Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PLA2G2D | Q9UNK4 | 2/20 | 0.55 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.51 |
| ▸ | MEN1 | O00255 | 2/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.48 |
| ▸ | GRIN2D | O15399 | 1/20 | 0.47 |
| ▸ | GRIN2A | Q12879 | 1/20 | 0.47 |
| ▸ | GRIN2C | Q14957 | 1/20 | 0.47 |
| ▸ | CA12 | O43570 | 1/20 | 0.47 |
| ▸ | CA1 | P00915 | 1/20 | 0.47 |
| ▸ | CA2 | P00918 | 1/20 | 0.47 |
| ▸ | CA6 | P23280 | 1/20 | 0.47 |
| ▸ | CA9 | Q16790 | 1/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.43 |
| ▸ | UNG | P13051 | 1/20 | 0.43 |
| ▸ | PLAU | P00749 | 1/20 | 0.43 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.42 |
| ▸ | FOLH1 | Q04609 | 1/20 | 0.42 |
| ▸ | TTR | P02766 | 1/20 | 0.42 |
| ▸ | NR4A1 | P22736 | 1/20 | 0.41 |
| ▸ | NR4A2 | P43354 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL688784 | 0.85 | PTPN1 (0.66) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL11855390 | 0.80 | GRIN2D (0.60) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL70529 | 0.79 | PTPN1 (0.73) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL29407063 | 0.79 | PTPN1 (0.73) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL30304410 | 0.79 | GRIN2D (0.58) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL689384 | 0.79 | GRIN2D (0.58) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL2469905 | 0.79 | GRIN2D (0.66) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL1671220 | 0.78 | PLA2G2D (0.55) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| SCHEMBL30791056 | 0.78 | PLAU (0.66) | PLA2G2DPTPN1MEN1KMT2AGRIN2D | |
| Hydrochloric Acid SCHEMBL21839297 | 0.78 | PTPN1 (0.71) | PLA2G2DPTPN1MEN1KMT2AGRIN2D |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 316 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1630605-B1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2017-10-11 | — | — | EP | claimed |
| CN-122029489-A | Photosensitive resin composition, cured product, display device, and electronic component | 东丽株式会社 | 2026-05-12 | — | — | CN | disclosed |
| EP-4738010-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME | Toray Industries, Inc. (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| US-12545784-B2 | Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2026-02-10 | — | — | US | disclosed |
| EP-4668018-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE | Toray Industries, Inc. (JP) | 2025-12-24 | — | — | EP | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-1496395-A2 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2005-01-12 | — | — | EP | disclosed |
| EP-1475665-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-11-10 | — | — | EP | disclosed |
| US-20040197703-A1 | Positive-type photosensitive resin composition | TORAY INDUSTRIES, INC. (JP) | 2004-10-07 | — | — | US | disclosed |
| US-20040053156-A1 | Photosensitive resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1388758-A1 | Photosensitive heat resistant resin precursor composition | TORAY INDUSTRIES, INC. (JP) | 2004-02-11 | — | — | EP | disclosed |
| EP-1365289-A1 | PRECURSOR COMPOSITION FOR POSITIVE PHOTOSENSITIVE RESIN AND DISPLAY MADE WITH THE SAME | TORAY INDUSTRIES, INC. (JP) | 2003-11-26 | — | — | EP | disclosed |
| US-20030194631-A1 | Precursor composition for positive photosensitive resin and display made with the same | TORAY INDUSTRIES, INC. (JP) | 2003-10-16 | — | — | US | disclosed |
| US-6593043-B2 | Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. | TORAY INDUSTRIES, INC. (JP) | 2003-07-15 | — | — | US | disclosed |
| US-20020090564-A1 | Polyamic acid ester and/or a polyamic acid having specific end groups; compound having a phenolic hydroxyl group; and a quinonediazide sulfonate. | TORAY INDUSTRIES, INC. (JP) | 2002-07-11 | — | — | US | disclosed |
| EP-1209523-A2 | Composition of positive photosensitive resin precursor, and display device made thereof | TORAY INDUSTRIES, INC. (JP) | 2002-05-29 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | PLA2G2D 1891/4885PTPN1 2077/4885MEN1 4037/4885 |
| US-12545784-B2 | Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device | ASIC1, ASIC3, TET3 | PLA2G2D 3930/4885PTPN1 2994/4885MEN1 1473/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | PLA2G2D 2893/4885PTPN1 923/4885MEN1 2185/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.