SCHEMBL6901467

SCHEMBL6901467

NCC(O)CCC(O)CN

nearest known ligand 0.47

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
GABRR1 P24046 3/20 0.45
LMNA P02545 2/20 0.45
CETP P11597 1/20 0.42
CYP1A2 P05177 1/20 0.41
CYP2C9 P11712 1/20 0.41
TSHR P16473 1/20 0.41
HIF1A Q16665 1/20 0.41
GABBR2 O75899 1/20 0.39
GABBR1 Q9UBS5 1/20 0.39
KDM4E B2RXH2 1/20 0.32
HTT P42858 1/20 0.32
THRB P10828 1/20 0.32
ALDH1A1 P00352 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28969419 0.89
SCHEMBL27820254 0.87
SCHEMBL8457317 0.87 THRB (0.53) GABRR1LMNACETPCYP1A2CYP2C9
SCHEMBL15871155 0.87 GABRR1 (0.38) GABRR1LMNACETPCYP1A2CYP2C9
SCHEMBL21575 0.85
SCHEMBL8486581 0.85
SCHEMBL20484614 0.85 GABRR1 (0.41) GABRR1LMNACETPCYP1A2CYP2C9
SCHEMBL13745483 0.85
SCHEMBL20709496 0.84
SCHEMBL28356327 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-6306068-A None JP disclosed
CN-119930500-A Diamine monomer for synthesizing photosensitive polyimide and preparation method thereof 化学与精细化工广东省实验室 2025-05-06 CN disclosed
US-11822243-B2 Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor TORAY INDUSTRIES, INC. (JP) 2023-11-21 US disclosed
US-11561470-B2 Negative photosensitive resin composition, cured film, element provided with cured film, organic EL display provided with cured film, and method for producing same TORAY INDUSTRIES, INC. (JP) 2023-01-24 US disclosed
CN-115152007-A Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing solder bump-attached electrode substrate 昭和电工材料株式会社 2022-10-04 CN disclosed
CN-109804310-B Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same 东丽株式会社 2022-09-30 CN disclosed
CN-114460809-A Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same 东丽株式会社 2022-05-10 CN disclosed
CN-108885399-B Negative photosensitive resin composition, cured film, display device provided with cured film, and method for producing same 东丽株式会社 2022-03-15 CN disclosed
CN-108604062-B Negative photosensitive resin composition, cured film, display device having cured film, and method for producing same 东丽株式会社 2021-11-09 CN disclosed
CN-108027561-B Negative photosensitive resin composition, cured film, element and display device provided with cured film, and method for producing same 东丽株式会社 2021-10-08 CN disclosed
CN-108885399-A Negative light-sensitive resin combination, cured film, the display device and its manufacturing method for having cured film 东丽株式会社 2018-11-23 CN disclosed
CN-108604062-A Negative light-sensitive resin combination, cured film, display device and its manufacturing method with cured film 东丽株式会社 2018-09-28 CN disclosed
US-20180259852-A1 NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME TORAY INDUSTRIES, INC. (JP) 2018-09-13 US disclosed
US-20180251421-A1 NOVEL BETA-HYDROXYLATED TERTIARY DIAMINES, A PROCESS FOR THEIR SYNTHESIS AND THEIR USE FOR ELIMINATING ACID COMPOUNDS A GASEOUS EFFLUENT IFP Energies Nouvelles (FR) 2018-09-06 US disclosed
CN-108027561-A Negative light-sensitive resin combination, cured film, the element for possessing cured film and display device and its manufacture method 东丽株式会社 2018-05-11 CN disclosed
EP-0982385-B1 ADHESIVE, METHOD FOR BONDING, AND ASSEMBLIES OF MOUNTED BOARDS FUJITSU LTD (JP) 2004-01-28 EP disclosed
US-6576081-B2 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A FUJITSU LIMITED (JP) 2003-06-10 US disclosed
US-20020084019-A1 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A FUJITSU LIMITED (JP) 2002-07-04 US disclosed
EP-0982385-A1 ADHESIVE, METHOD FOR BONDING, AND ASSEMBLIES OF MOUNTED BOARDS FUJITSU LIMITED (JP) 2000-03-01 EP disclosed
JP-H06306068-A AMINE COMPOUND, PRODUCTION THERE OF AND CATALYST FOR URETHANIZING REACTION SAN APPRO KK 1994-11-01 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180251421-A1 NOVEL BETA-HYDROXYLATED TERTIARY DIAMINES, A PROCESS FOR THEIR SYNTHESIS AND THEIR USE FOR ELIMINATING ACID COMPOUNDS A GASEOUS EFFLUENT AOC1, DHODH, DDAH1 GABRR1 4158/4885LMNA 3225/4885CETP 1583/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.