SCHEMBL6906357

SCHEMBL6906357

C=Cc1cc(C=C)cc([Si](OCC)(OCC)OCC)c1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL437296 0.82 TP53 (0.44)
SCHEMBL29434674 0.82 TP53 (0.44)
SCHEMBL431999 0.80 ALDH1A1 (0.44)
SCHEMBL315824 0.78
SCHEMBL30018341 0.76 ALDH1A1 (0.39)
SCHEMBL6909166 0.73
SCHEMBL31494219 0.71
SCHEMBL31494214 0.71
SCHEMBL29160575 0.71 TP53 (0.48)
SCHEMBL13027895 0.70 NOS3 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6709715-B1 DEPOSITING DIELECTRIC LAYER; USING SUCH AS TETRAVINYL-TETRAMETHYLCYCLOTETRASILOXANE, TETRAALLYLOXYSILANE OR TRIVINYLMETHYLSILANE APPLIED MATERIALS INC. 2004-03-23 US disclosed
US-6362115-B1 DISSOCIATING 1,4-BIS(FORMATOMETHYL)BENZENE OR 1,4-BIS(N-METHYLAMINOMETHYL) BENZENE, CONDENSING P-XYLYLENE TO FORM A POLYMERIZED THIN POLYMER OR COPOLYMER LAYER; LOW DIELECTRIC CONSTANTS; SEMICONDUCTORS APPLIED MATERIALS, INC. 2002-03-26 US disclosed
EP-1098718-A1 CHEMICAL VAPOR DEPOSITION OF A COPOLYMER OF P-XYLYLENE AND A MULTIVINYL SILICON/OXYGEN COMONOMER Applied Materials, Inc. (US) 2001-05-16 EP disclosed
US-6086952-A Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer APPLIED MATERIALS, INC. (US) 2000-07-11 US disclosed
WO-1999065617-A1 CHEMICAL VAPOR DEPOSITION OF A COPOLYMER OF P-XYLYLENE AND A MULTIVINYL SILICON/OXYGEN COMONOMER APPLIED MATERIALS, INC. (US) 1999-12-23 WO disclosed