SCHEMBL6906998

SCHEMBL6906998

CCCC(C)(F)S(=O)(=O)O

nearest known ligand 0.36

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
FDPS P14324 2/20 0.36
LPAR1 Q92633 1/20 0.34
LPAR3 Q9UBY5 1/20 0.34
ALDH1A1 P00352 2/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
EPHX1 P07099 1/20 0.33
CES1 P23141 5/20 0.31
FAAH O00519 3/20 0.31
CES2 O00748 3/20 0.31
LMNA P02545 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7896010 0.84 LPAR1 (0.48) FDPSLPAR1LPAR3EPHX1CES1
SCHEMBL15216843 0.79
SCHEMBL15702986 0.78 EPHX1 (0.32) FDPSALDH1A1L3MBTL1EPHX1
SCHEMBL16272658 0.78 EPHX1 (0.33) LPAR1LPAR3EPHX1
SCHEMBL3871127 0.77 LPAR1 (0.35) FDPSLPAR1LPAR3ALDH1A1L3MBTL1
Ammonia Solution, Strong SCHEMBL18008823 0.76 EPHX1 (0.31) ALDH1A1L3MBTL1EPHX1
SCHEMBL21136014 0.76 CES1 (0.32) ALDH1A1L3MBTL1EPHX1CES1
Sulfuric Acid SCHEMBL5488887 0.75 CES1 (0.34) FDPSLPAR1LPAR3EPHX1CES1
Ammonia Solution, Strong SCHEMBL18008280 0.75 LPAR1 (0.34) FDPSLPAR1LPAR3ALDH1A1L3MBTL1
SCHEMBL18008964 0.75 EPHX1 (0.31) ALDH1A1L3MBTL1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11703756-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-18 US disclosed
US-11703757-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-18 US disclosed
US-20230205084-A1 RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2023-06-29 US disclosed
US-20190196326-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2019-06-27 US disclosed
US-20180149973-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND, AND ACID GENERATOR TOKYO OHKA KOGYO CO., LTD. (JP) 2018-05-31 US disclosed
US-9766541-B2 Positive-type resist composition, method for forming resist pattern, photo-reactive quencher, and polymeric compound TOKYO OHKA KOGYO CO., LTD. (JP) 2017-09-19 US disclosed
US-20170168396-A1 METHOD FOR FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2017-06-15 US disclosed
US-9618845-B2 Method for forming resist pattern, resist pattern splitting agent, split pattern improving agent, resist pattern splitting material, and positive resist composition for forming split pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2017-04-11 US disclosed
US-9581909-B2 Method of trimming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2017-02-28 US disclosed
US-20160376233-A1 POSITIVE-TYPE RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, PHOTO-REACTIVE QUENCHER, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2016-12-29 US disclosed
US-9354515-B2 Resist composition, acid generator, polymeric compound and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-05-31 US disclosed
US-20160097979-A1 METHOD OF TRIMMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2016-04-07 US disclosed
US-20160091790-A1 METHOD FOR FORMING RESIST PATTERN, RESIST PATTERN SPLITTING AGENT, SPLIT PATTERN IMPROVING AGENT, RESIST PATTERN SPLITTING MATERIAL, AND POSITIVE RESIST COMPOSITION FOR FORMING SPLIT PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2016-03-31 US disclosed
US-9244347-B2 Resist composition, compound, polymeric compound and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2016-01-26 US disclosed
US-20150037734-A1 RESIST COMPOSITION, ACID GENERATOR, POLYMERIC COMPOUND AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2015-02-05 US disclosed
US-20140356787-A1 RESIST COMPOSITION, COMPOUND, POLYMERIC COMPOUND AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2014-12-04 US disclosed
US-6737459-B2 COMPRISING A RECOVERED POLYSTYRENE RESIN FROM WASTE RECYCLING, AND A FLAME RETARDATION REAGENT GENERAL ELECTRIC COMPANY 2004-05-18 US disclosed
US-20030119953-A1 Polyphenylene ether group resin composite and methods of making articles CITIBANK, N.A., AS COLLATERAL AGENT 2003-06-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20190196326-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE RER1, ACTR5, RAD51 FDPS 1760/4885LPAR1 2590/4885LPAR3 3510/4885
US-20160376233-A1 POSITIVE-TYPE RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, PHOTO-REACTIVE QUENCHER, AND POLYMERIC COMPOUND RB1, RPL22, RPS21 FDPS 4530/4885LPAR1 272/4885LPAR3 816/4885
US-20180149973-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, COMPOUND, AND ACID GENERATOR MCM4, RFC4, ATP1A4 FDPS 3408/4885LPAR1 997/4885LPAR3 1703/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.