⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL531168 | 0.74 | — | — | |
| SCHEMBL22685224 | 0.74 | TSHR (0.43) | — | |
| SCHEMBL26381419 | 0.74 | MCL1 (0.36) | — | |
| Phosphoric Acid SCHEMBL28972551 | 0.72 | LMNA (0.39) | — | |
| SCHEMBL3633114 | 0.72 | EGLN1 (0.41) | — | |
| SCHEMBL27457306 | 0.70 | EGLN1 (0.40) | — | |
| SCHEMBL22972312 | 0.70 | TSHR (0.33) | — | |
| Succinic Acid SCHEMBL28354180 | 0.69 | EGLN1 (0.45) | — | |
| SCHEMBL20598734 | 0.67 | LAP3 (0.39) | — | |
| SCHEMBL12559707 | 0.67 | EGLN1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6515081-B2 | Thermosetting resin, compound containing one functional group which can react with thermosetting resin or its curing agent; sports applications, aerospace applications, industrial applications | TORAY INDUSTRIES, INC. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-6399199-B1 | EPOXY RESIN, CURING AGENT AND MATRIX RESIN | TORAY INDUSTRIES INC. (JP) | 2002-06-04 | — | — | US | disclosed |
| US-20020007022-A1 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2002-01-17 | — | — | US | disclosed |
| EP-0947562-A1 | EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIAL, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES, INC. (JP) | 1999-10-06 | — | — | EP | disclosed |