SCHEMBL6937463

SCHEMBL6937463

O=C(Oc1ccc(C(c2ccc(OC(=O)c3ccccc3)cc2)(C(F)(F)F)C(F)(F)F)cc1)c1ccccc1

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.66
TDP1 Q9NUW8 2/20 0.66
L3MBTL1 Q9Y468 1/20 0.66
PARP10 Q53GL7 1/20 0.56
KMT2A Q03164 11/20 0.54
MEN1 O00255 3/20 0.54
ALDH1A1 P00352 3/20 0.53
PKM P14618 1/20 0.53
RAB9A P51151 1/20 0.50
PRSS1 P07477 2/20 0.48
ACR P10323 2/20 0.48
THRB P10828 1/20 0.46
CASP3 P42574 1/20 0.46
SENP7 Q9BQF6 1/20 0.46
HSD17B10 Q99714 1/20 0.44
KDM4E B2RXH2 1/20 0.44
GAA P10253 1/20 0.44
NSD2 O96028 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.43
TMPRSS15 P98073 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13183994 0.94 MAPT (0.59) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL13161732 0.93 MAPT (0.61) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL25986623 0.91 MAPT (0.55) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL24157322 0.86 MAPT (0.70) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL14211088 0.85 MAPT (0.57) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL25986622 0.83 KMT2A (0.50) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL8916665 0.83 LMNA (0.45) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL16395255 0.83 ESR1 (0.44) MAPTTDP1L3MBTL1KMT2AMEN1
SCHEMBL24696630 0.82 PTGS1 (0.46) MAPTTDP1L3MBTL1PARP10KMT2A
SCHEMBL9065358 0.82 MAPT (0.64) MAPTTDP1L3MBTL1PARP10KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118076662-A Resin curing agent, curable resin composition, cured product, electronic device, laminate material, electronic component sealing material, ester compound, method for producing ester compound, and method for producing novolac resin 中央硝子株式会社 2024-05-24 CN disclosed
WO-2023080072-A1 RESIN CURING AGENT, CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, LAMINATE SHEET MATERIAL, ELECTRONIC COMPONENT SEALING MATERIAL, ESTER COMPOUND, METHOD FOR PRODUCING ESTER COMPOUND, AND METHOD FOR PRODUCING NOVOLAC RESIN セントラル硝子株式会社 2023-05-11 WO disclosed
US-20170175078-A1 CELL CULTURE SUBSTRATE COMPRISING FLUORINE-CONTAINING POLYMER ON ITS SURFACE NIPPON SHOKUBAI, CO., LTD. (JP) 2017-06-22 US disclosed
US-7678881-B2 Transparent resin material NIPPON SHOKUBAI CO., LTD. (JP) 2010-03-16 US disclosed
US-7589228-B2 Fluorine-containing compound NIPPON SHOKUBAI CO., LTD. (JP) 2009-09-15 US disclosed
EP-0972776-B1 A phosphine sulfide, a manufacturing process therefor and a use thereof MITSUI CHEMICALS INC (JP) 2003-04-23 EP disclosed
US-6153794-A Phosphine sulfide, a manufacturing process therefor and use thereof MITSUI CHEMICALS, INC. (JP) 2000-11-28 US disclosed
EP-0972776-A1 A phosphine sulfide, a manufacturing process therefor and a use thereof Mitsui Chemicals, Inc. (JP) 2000-01-19 EP disclosed