Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 4/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | MAOB | P27338 | 1/20 | 0.38 |
| ▸ | MAOA | P21397 | 1/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | GPR84 | Q9NQS5 | 1/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | BCHE | P06276 | 2/20 | 0.35 |
| ▸ | ACHE | P22303 | 2/20 | 0.35 |
| ▸ | NOS3 | P29474 | 2/20 | 0.35 |
| ▸ | NOS1 | P29475 | 2/20 | 0.35 |
| ▸ | NOS2 | P35228 | 2/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.34 |
| ▸ | HTT | P42858 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15283066 | 0.88 | GAA (0.39) | LTA4HALDH1A1SMN1; SMN2GAATSHR | |
| SCHEMBL7896778 | 0.79 | MAOB (0.41) | LTA4HALDH1A1MAOBMAOASMN1; SMN2 | |
| SCHEMBL7776603 | 0.78 | LTA4H (0.52) | LTA4HALDH1A1MAOBMAOASMN1; SMN2 | |
| SCHEMBL694250 | 0.77 | SLC6A4 (0.44) | LTA4HALDH1A1MAOBMAOASMN1; SMN2 | |
| SCHEMBL10937484 | 0.76 | PTGS1 (0.51) | LMNA | |
| SCHEMBL10953508 | 0.76 | MAOB (0.35) | LTA4HALDH1A1MAOBMAOACYP3A4 | |
| SCHEMBL29126547 | 0.76 | LTA4H (0.40) | LTA4HALDH1A1MAOBMAOASMN1; SMN2 | |
| SCHEMBL1602038 | 0.76 | ALDH1A1 (0.45) | ALDH1A1MAOASMN1; SMN2GPR84TP53 | |
| SCHEMBL6004009 | 0.74 | ALDH1A1 (0.43) | ALDH1A1SMN1; SMN2GPR84TP53CYP3A4 | |
| SCHEMBL2763252 | 0.73 | HRH1 (0.41) | LTA4HALDH1A1MAOBMAOAGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 116 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2555053-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2017-10-18 | — | — | EP | claimed |
| EP-2555053-A1 | Positive-type photosensitive resin composition | Toray Industries, Inc. (JP) | 2013-02-06 | — | — | EP | claimed |
| EP-0861281-B1 | Thermosetting bismaleimide polymer for composite and adhesive applications | CYTEC TECH CORP (US) | 2002-06-05 | — | — | EP | claimed |
| US-6313248-B1 | CURABLE SOLID AROMATIC DIAMINE BISMALEIMIDE AND LIQUID ALKENYLPHENYL RESINS; DECREASED WEIGHT LOSS UPON AGING | CYTEC TECHNOLOGY CORP. | 2001-11-06 | — | — | US | claimed |
| EP-0861280-A1 | THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS | Cytec Technology Corp. (US) | 1998-09-02 | — | — | EP | claimed |
| EP-0861281-A1 | THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS | Cytec Technology Corp. (US) | 1998-09-02 | — | — | EP | claimed |
| WO-1997018254-A1 | THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS | CYTEC TECHNOLOGY CORP. (US) | 1997-05-22 | — | — | WO | claimed |
| WO-1997018255-A1 | THERMOSETTING POLYMERS FOR COMPOSITE AND ADHESIVE APPLICATIONS | CYTEC TECHNOLOGY CORP. (US) | 1997-05-22 | — | — | WO | claimed |
| US-4808646-A | Maleimide-maleamic acid resin solution | MONSANTO COMPANY (US) | 1989-02-28 | — | — | US | claimed |
| US-4696994-A | Transparent aromatic polyimide | UBE INDUSTRIES, LTD. (JP) | 1987-09-29 | — | — | US | claimed |
| JP-61151237-A | — | — | None | — | — | JP | disclosed |
| CN-114539524-B | Photosensitive resin precursor polymer, photosensitive resin composition slurry and application thereof | 吉林奥来德光电材料股份有限公司 | 2023-12-26 | — | — | CN | disclosed |
| CN-111830786-B | Photosensitive resin composition containing silane coupling agent | 波米科技有限公司 | 2023-05-23 | — | — | CN | disclosed |
| CN-110333647-B | Positive photosensitive resin composition | 波米科技有限公司 | 2023-04-14 | — | — | CN | disclosed |
| CN-114895527-A | Positive photosensitive resin precursor composition, preparation method and application thereof | 南通晶爱微电子科技有限公司 | 2022-08-12 | — | — | CN | disclosed |
| EP-0290910-A1 | Special polyimide as thermoplast | BAYER AG (DE) | 1988-11-17 | — | — | EP | disclosed |
| WO-1988007563-A1 | POLYAMIDE-IMIDE COMPOSITIONS | AMOCO CORPORATION (US) | 1988-10-06 | — | — | WO | disclosed |
| US-4696994-A | Transparent aromatic polyimide | UBE INDUSTRIES, LTD. (JP) | 1987-09-29 | — | — | US | disclosed |
| US-4696994-A | Transparent aromatic polyimide | UBE INDUSTRIES, LTD. (JP) | 1987-09-29 | — | — | US | disclosed |
| JP-S61151237-A | TRANSPARENT AROMATIC POLYIMIDE AND ITS COMPOSITION | UBE IND LTD | 1986-07-09 | — | — | JP | disclosed |