SCHEMBL701312

SCHEMBL701312

CC(=CC(C)CC(O)(C(F)(F)F)C(F)(F)F)C(=O)O

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2337022 1.00 MEN1 (0.33) MEN1KMT2A
SCHEMBL2401381 0.79 HTT (0.30)
SCHEMBL167527 0.76
SCHEMBL12275125 0.74
SCHEMBL12275130 0.74
SCHEMBL2333591 0.72 PDK1 (0.34)
SCHEMBL2333583 0.72 PDK1 (0.34)
SCHEMBL1839680 0.70 GRIK1 (0.31) MEN1KMT2A
SCHEMBL74357 0.70 GRIK1 (0.31) MEN1KMT2A
SCHEMBL2871424 0.70 GRIK1 (0.31) MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9233840-B2 Method for improving self-assembled polymer features INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2016-01-12 US claimed
US-8486489-B2 Methods for aligning polymer films and related structures INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2013-07-16 US claimed
US-20090214823-A1 METHODS FOR ALIGNING POLYMER FILMS AND RELATED STRUCTURES INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2009-08-27 US claimed
CN-114835387-A Glass toughening treatment process 淄博泰康轻工制品有限公司 2022-08-02 CN disclosed
CN-114751656-A Tempered glass and preparation method thereof 淄博泰康轻工制品有限公司 2022-07-15 CN disclosed
US-10359698-B2 Compositions comprising hetero-substituted carbocyclic aryl component and processes for photolithography ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2019-07-23 US disclosed
US-10180627-B2 Processes for photolithography ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2019-01-15 US disclosed
US-9802400-B2 Orientation control layer formed on a free top surface of a first block copolymer from a mixture of first and second block copolymers DOW GLOBAL TECHNOLOGIES LLC (US) 2017-10-31 US disclosed
US-20170160637-A9 UPPER LAYER-FORMING COMPOSITION AND RESIST PATTERNING METHOD JSR CORPORATION (JP) 2017-06-08 US disclosed
US-9507260-B2 Compositions and processes for photolithography ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2016-11-29 US disclosed
US-9500950-B2 Fluorine-containing polymer, purification method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2016-11-22 US disclosed
US-20100285405-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-11-11 US disclosed
US-20100255416-A1 COMPOSITION FOR FORMING UPPER LAYER FILM FOR IMMERSION EXPOSURE, UPPER LAYER FILM FOR IMMERSION EXPOSURE, AND METHOD OF FORMING PHOTORESIST PATTERN JSR CORPORATION (JP) 2010-10-07 US disclosed
US-20100239981-A1 POLYMER AND POSITIVE-TONE RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-09-23 US disclosed
US-20100221664-A1 RADIATION-SENSITIVE COMPOSITION JSR CORPORATION (JP) 2010-09-02 US disclosed
US-20100112475-A1 RESIN FOR FORMATION OF UPPER ANTIREFLECTIVE FILM, COMPOSITION FOR FORMATION OF UPPER ANTIREFLECTIVE FILM, AND RESIST PATTERN FORMATION METHOD JSR CORPORATION (JP) 2010-05-06 US disclosed
US-20100068650-A1 POSITIVE-WORKING RADIATION-SENSITIVE COMPOSITION AND METHOD FOR RESIST PATTERN FORMATION USING THE COMPOSITION JSR CORPORATION (JP) 2010-03-18 US disclosed
US-20100047712-A1 TOP ANTIREFLECTIVE COATING COMPOSITION CONTAINING HYDROPHOBIC AND ACIDIC GROUPS INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2010-02-25 US disclosed
US-20100040974-A1 UPPER LAYER FILM FORMING COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN JSR CORPORATION (JP) 2010-02-18 US disclosed
US-20090202945-A1 FLUORINE-CONTAINING POLYMER, PURIFICATION METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2009-08-13 US disclosed