SCHEMBL702620

SCHEMBL702620

CC(C)[SiH](OCCCc1ccccc1)C(C)C

nearest known ligand 0.50

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 1/20 0.50
LMNA P02545 1/20 0.43
SIGMAR1 Q99720 6/20 0.42
HTR2A P28223 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL706264 0.95 IDO1 (0.44) IDO1SIGMAR1L3MBTL1
SCHEMBL704128 0.89 CA1 (0.40) IDO1SIGMAR1
SCHEMBL104984 0.79 IDO1 (0.55) IDO1LMNASIGMAR1L3MBTL1
SCHEMBL704040 0.76 TSHR (0.46) IDO1LMNASIGMAR1L3MBTL1
SCHEMBL706647 0.76 IDO1 (0.52) IDO1LMNASIGMAR1L3MBTL1
SCHEMBL12530260 0.75 IDO1 (0.55) IDO1LMNASIGMAR1L3MBTL1
SCHEMBL707650 0.74 IDO1 (0.50) IDO1LMNASIGMAR1L3MBTL1
SCHEMBL104848 0.73 IDO1 (0.48) IDO1SIGMAR1L3MBTL1
SCHEMBL19926924 0.73 SIGMAR1 (0.43) SIGMAR1
SCHEMBL708505 0.73 IDO1 (0.48) IDO1LMNASIGMAR1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed