SCHEMBL703088

SCHEMBL703088

CCCCC(CCCC)(CCCC)C(=O)O[SiH3]

nearest known ligand 0.46

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CYP4F2 P78329 2/20 0.46
CYP4A11 Q02928 2/20 0.46
MEN1 O00255 1/20 0.37
MAPT P10636 1/20 0.37
KMT2A Q03164 1/20 0.37
ATM Q13315 1/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
CES2 O00748 1/20 0.36
FDPS P14324 6/20 0.34
GGPS1 O95749 3/20 0.34
SMPD1 P17405 2/20 0.34
ALDH1A1 P00352 1/20 0.33
THRB P10828 1/20 0.33
PKM P14618 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2065097 0.95 CYP4F2 (0.46) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL703499 0.86 CYP4F2 (0.39) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL10814845 0.81 CYP4F2 (0.39) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL28886961 0.80 CES2 (0.44) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL705409 0.80 CYP4F2 (0.36) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL28730000 0.79 EPHX1 (0.43) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL27614308 0.79 CYP4F2 (0.38) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL7758101 0.79 CYP4F2 (0.42) CYP4F2CYP4A11MEN1MAPTKMT2A
SCHEMBL8193025 0.78 EPHX1 (0.48) MEN1MAPTKMT2AATML3MBTL1
SCHEMBL167166 0.78 CYP4F2 (0.43) CYP4F2CYP4A11ALDH1A1THRBPKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
EP-1165682-B1 RESIN COMPOSITION AND CURED PRODUCT DSM IP ASSETS BV (NL) 2006-07-05 EP disclosed
US-7005398-B2 Olefin polymerization catalyst, catalyst component for olefin polymerization, method of storing these, and process for producing olefin polymer SUNALLOMER LTD. (JP) 2006-02-28 US disclosed
US-6727334-B2 FOR FORMING COATINGS WITH HIGH HARDNESS, SCRATCH RESISTANCE, LOW CURLING PROPERTIES, ADHESION, AND TRANSPARENCY, AND FINE APPEARANCE ON THE SURFACE OF VARIOUS SUBSTRATES FOR SUCH AS PLASTICS DSM N.V. (NL) 2004-04-27 US disclosed
US-20040054102-A1 Olefin polymerization catalyst, catalyst component for olefin polymerization, method of storing these, and process for producing olefin polymer SUNALLOMER LTD. (JP) 2004-03-18 US disclosed
EP-0965618-B1 Photo-curable composition and photo-cured product JSR CORP (JP) 2004-01-02 EP disclosed
EP-1359166-A1 OLEFIN POLYMERIZATION CATALYST, CATALYST COMPONENT FOR OLEFIN POLYMERIZATION, METHOD OF STORING THESE, AND PROCESS FOR PRODUCING OLEFIN POLYMER Sunallomer Ltd (JP) 2003-11-05 EP disclosed
WO-2003072662-A1 METHOD OF PRODUCING ORGANOACYLOXYSILANES ATOFINA (FR) 2003-09-04 WO disclosed
US-20020058737-A1 Resin composition and cured product JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1165682-A1 RESIN COMPOSITION AND CURED PRODUCT DSM N.V. (NL) 2002-01-02 EP disclosed
US-6207728-B1 COMPOSITION COMPRISING BOTH HYDROLYZABLE SILANE COMPOUND AND HYDROLYZATE THEREOF OR EITHER ONE, PHOTO ACID GENERATOR, DEHYDRATING AGENT JSR CORPORATION (JP) 2001-03-27 US disclosed
WO-2000047666-A1 RESIN COMPOSITION AND CURED PRODUCT DSM N.V. (NL) 2000-08-17 WO disclosed
EP-0965618-A1 Photo-curable composition and photo-cured product JSR Corporation (JP) 1999-12-22 EP disclosed
EP-0240952-A2 A method for producing a flaky material SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-10-14 EP disclosed