SCHEMBL703630

SCHEMBL703630

CC(=O)O[SiH](OC(C)=O)C(C)C

nearest known ligand 0.41

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.41
ALDH1A1 P00352 2/20 0.35
CHRM2 P08172 1/20 0.31
CHRM4 P08173 1/20 0.31
CHRM1 P11229 1/20 0.31
TBXA2R P21731 1/20 0.31
GALR3 O60755 1/20 0.30
MAPT P10636 1/20 0.30
BLM P54132 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27885882 0.88 TSHR (0.33) TSHR
SCHEMBL4644355 0.77 TSHR (0.41) TSHRALDH1A1CHRM2CHRM4CHRM1
SCHEMBL23092978 0.74
SCHEMBL5359678 0.74 TSHR (0.35) TSHRALDH1A1CHRM2CHRM4CHRM1
SCHEMBL6699198 0.74 TSHR (0.35) TSHR
SCHEMBL27722874 0.72 TSHR (0.33) TSHRCHRM2CHRM4CHRM1TBXA2R
SCHEMBL216030 0.72 TSHR (0.33) TSHRALDH1A1
SCHEMBL6562682 0.72 TSHR (0.33) TSHR
SCHEMBL203518 0.67 ALDH1A1 (0.44) TSHRALDH1A1BLM
SCHEMBL2771869 0.67 ALDH1A1 (0.44) TSHRALDH1A1BLM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3103842-B1 CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW TORAY CO LTD (JP) 2023-01-11 EP disclosed
CN-108351444-B Phosphor sheet, light-emitting body using same, light source unit, display, and method for manufacturing light-emitting body 东丽株式会社 2021-10-26 CN disclosed
CN-106537618-B Laminate and method for manufacturing light-emitting device using same 东丽株式会社 2020-04-21 CN disclosed
CN-106255728-B Curable silicon composition, cured product thereof, and optical semiconductor device 陶氏东丽株式会社 2019-07-02 CN disclosed
CN-105960438-B Curable silicon composition, cured product thereof, and optical semiconductor device 陶氏东丽株式会社 2019-05-28 CN disclosed
EP-3103843-B1 CURABLE SILICONE COMPOSITION, CURED OBJECT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO LTD (JP) 2019-03-27 EP disclosed
CN-108351444-A Phosphor plates use the manufacturing method of its illuminator, light source unit, display and illuminator 东丽株式会社 2018-07-31 CN disclosed
US-9944759-B2 Curable silicone composition, cured product therefrom, and optical semiconductor device DOW CORNING TORAY CO., LTD. (JP) 2018-04-17 US disclosed
EP-2913855-B1 FLUORESCENT-MATERIAL-CONTAINING RESIN SHEET AND LIGHT-EMITTING DEVICE TORAY INDUSTRIES (JP) 2017-09-06 EP disclosed
US-9657224-B2 Fluorescent-material-containing resin sheet and light-emitting device TORAY INDUSTRIES, INC. (JP) 2017-05-23 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
CN-101639628-A Radioactive linear composition for forming of coloring layer, color filter and color liquid crystal display element JSR CORP JP 2010-02-03 CN disclosed
CN-101515113-A Radioactive ray sensibility resin composition, interlayer insulating film, microlens and method of forming the same JSR CORP (JP) 2009-08-26 CN disclosed
CN-101324755-A Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof JSR CORP (JP) 2008-12-17 CN disclosed
CN-100369995-C Curing composition for organosilicon compound and silicone-based coating agent composition SHINETSU CHEMICAL CO (JP) 2008-02-20 CN disclosed
US-7193026-B2 Organosilicon compound-curing composition and silicone-base coating composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-03-20 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
CN-1637098-A Curing composition for organosilicon compound and silicone-based coating agent composition SHINETSU CHEMICAL CO (JP) 2005-07-13 CN disclosed
US-20040260048-A1 Organosilicon compound - curing composition and silicone-base coating composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-12-23 US disclosed
US-6268440-B1 MIXING WATER BASED COMPOSITE RESINS AND POLYSILOXANES WITH CONDENSATION REACTION, DISPERSION AND DISSOLVING DAINIPPON INK AND CHEMICALS, INC. (JP) 2001-07-31 US disclosed