Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL707249 | 0.86 | NR1H2 (0.36) | NR1H2NR1H3 | |
| SCHEMBL707762 | 0.75 | NR1H2 (0.37) | NR1H2NR1H3 | |
| SCHEMBL14128735 | 0.66 | TRPV4 (0.37) | NR1H2NR1H3 | |
| SCHEMBL702684 | 0.63 | NR1H2 (0.36) | NR1H2NR1H3 | |
| SCHEMBL13933322 | 0.63 | NR1H2 (0.36) | NR1H2NR1H3 | |
| SCHEMBL704604 | 0.63 | NR1H2 (0.36) | NR1H2NR1H3 | |
| SCHEMBL703007 | 0.62 | NR1H2 (0.32) | NR1H2NR1H3 | |
| SCHEMBL706457 | 0.62 | ESR1 (0.40) | NR1H2NR1H3 | |
| SCHEMBL707010 | 0.62 | NR1H2 (0.32) | NR1H2NR1H3 | |
| SCHEMBL704536 | 0.62 | NR1H2 (0.32) | NR1H2NR1H3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |