SCHEMBL704093

SCHEMBL704093

CC[SiH2]OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Water SCHEMBL27534295 0.97
SCHEMBL707439 0.76
SCHEMBL704931 0.76
SCHEMBL28692974 0.75
SCHEMBL707850 0.75
SCHEMBL15312341 0.73
SCHEMBL28898368 0.73
SCHEMBL704129 0.71
SCHEMBL9244624 0.71
SCHEMBL1225117 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102653638-B Thermosetting dip-coating composition DAEJOO NANO SOLAR (KR) 2015-11-25 CN claimed
CN-102653638-A Thermosetting dip-coating composition DAEJOO NANO SOLAR 2012-09-05 CN claimed
CN-109423309-B Liquid crystal alignment agent, liquid crystal alignment film and liquid crystal display assembly 奇美实业股份有限公司 2023-08-04 CN disclosed
CN-113330078-B Release layer and product containing release layer 3M创新有限公司 2022-12-02 CN disclosed
WO-2022230944-A1 PLANARIZING FILM MANUFACTURING METHOD, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-11-03 WO disclosed
CN-110317457-B Polysilazane composition, coated substrate, and multilayer structure 信越化学工业株式会社 2022-09-16 CN disclosed
CN-113330078-A Release layer and product containing release layer 3M创新有限公司 2021-08-31 CN disclosed
US-10759119-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2020-09-01 US disclosed
US-10279603-B2 Production method of recording material, and recording material SEIKO EPSON CORPORATION (JP) 2019-05-07 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-20190054704-A1 THREE DIMENSIONAL MOLD OBJECT MANUFACTURING APPARATUS, METHOD FOR MANUFACTURING THREE DIMENSIONAL MOLD OBJECT, AND THREE DIMENSIONAL MOLD OBJECT SEIKO EPSON CORPORATION (JP) 2019-02-21 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
CN-1891757-A Silica film forming material, silica film and method of manufacturing the same FUJITSU LTD (JP) 2007-01-10 CN disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed
CN-1713787-A Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORP (JP) 2005-12-28 CN disclosed
US-6294313-B1 PHOTOCATALYST-CONTAINING LAYER CONTAINING A MATERIAL OF WHICH THE WETTABILITY IS VARIABLE THROUGH PHOTOCATALYTIC ACTION UPON PATTERN-WISE EXPOSURE. DAI NIPPON PRINTING CO., LTD. (JP) 2001-09-25 US disclosed
WO-1998045368-A1 OLEFIN (CO-)POLYMER COMPOSITIONS AND METHOD OF PRODUCING THE SAME CHISSO CORPORATION (JP) 1998-10-15 WO disclosed