⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6703622 | 0.92 | LMNA (0.34) | — | |
| SCHEMBL28425455 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL28419043 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL14690126 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL6032545 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL28419929 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL6705278 | 0.90 | TSHR (0.38) | — | |
| SCHEMBL703483 | 0.86 | — | — | |
| SCHEMBL703803 | 0.86 | — | — | |
| SCHEMBL2956129 | 0.83 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111233916-A | Long carbon chain sulfur-containing silane coupling agent, and preparation method and application thereof | 南京曙光精细化工有限公司 | 2020-06-05 | — | — | CN | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| CN-100535054-C | Silica film forming material, silica film and preparation method thereof | FUJITSU LTD (JP) | 2009-09-02 | — | — | CN | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| CN-1891757-A | Silica film forming material, silica film and method of manufacturing the same | FUJITSU LTD (JP) | 2007-01-10 | — | — | CN | disclosed |
| US-20040076593-A1 | Composition containing a modified nitrocellulose | L'OREAL (FR) | 2004-04-22 | — | — | US | disclosed |
| EP-1342731-A1 | Cosmetic composition, especially nail enamel, comprising a modified nitrocellulose | L'OREAL (FR) | 2003-09-10 | — | — | EP | disclosed |