SCHEMBL704102

SCHEMBL704102

CC[Si](OC(C)=O)(OC(C)=O)c1ccccc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.41
MAPT P10636 1/20 0.40
CES2 O00748 2/20 0.38
CES1 P23141 2/20 0.38
MTNR1A P48039 2/20 0.36
MTNR1B P49286 2/20 0.36
HPGD P15428 2/20 0.35
TSHR P16473 2/20 0.35
PTGS2 P35354 2/20 0.35
ELANE P08246 1/20 0.35
LMNA P02545 1/20 0.35
KDM4E B2RXH2 1/20 0.35
ESR1 P03372 1/20 0.35
ITGB3 P05106 1/20 0.35
ITGA2B P08514 1/20 0.35
HMGB1 P09429 1/20 0.35
GGT1 P19440 1/20 0.35
PTGS1 P23219 1/20 0.35
BLM P54132 1/20 0.35
NAPRT Q6XQN6 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL703610 0.90 ESR1 (0.35) ALDH1A1HPGDLMNAESR1HSD17B10
SCHEMBL708008 0.86 ALDH1A1 (0.42) ALDH1A1MAPTCES2CES1MTNR1A
SCHEMBL712780 0.86 ALDH1A1 (0.42) ALDH1A1MAPTCES2CES1MTNR1A
SCHEMBL27769541 0.86 ALDH1A1 (0.35) ALDH1A1MAPTHPGDTSHRPTGS2
SCHEMBL705416 0.85 ALDH1A1 (0.39) ALDH1A1MAPTCES2CES1MTNR1A
SCHEMBL27775052 0.85 ALDH1A1 (0.41) ALDH1A1MAPTCES2CES1MTNR1A
SCHEMBL13089446 0.84 ALDH1A1 (0.36) ALDH1A1MAPTCES2CES1MTNR1A
SCHEMBL13089482 0.83 ALDH1A1 (0.35) ALDH1A1MAPTCES2CES1MTNR1A
SCHEMBL27618710 0.83 ALDH1A1 (0.40) ALDH1A1MAPTCES2CES1MTNR1A
SCHEMBL706255 0.83 L3MBTL1 (0.41) ALDH1A1MAPTCES2CES1MTNR1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109716544-B Sealing material composition for LED 日产化学株式会社 2021-11-09 CN disclosed
CN-109716544-A LED Encapulant composition 日产化学株式会社 2019-05-03 CN disclosed
WO-2014136806-A1 ORGANOPOLYSILOXANE AND MANUFACTURING METHOD THEREOF DOW CORNING TORAY CO., LTD. (JP) 2014-09-12 WO disclosed
WO-2014136805-A1 CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE DOW CORNING TORAY CO., LTD. (JP) 2014-09-12 WO disclosed
CN-101646718-B Curable resin composition, protective film, and method for forming protective film JSR CORP JP 2013-04-03 CN disclosed
CN-101639628-B Radioactive linear composition for forming of coloring layer, color filter and color liquid crystal display element JSR CORP JP 2013-04-03 CN disclosed
CN-101226329-B Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof JSR CORP 2012-09-05 CN disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
CN-101646718-A The formation method of curable resin composition, protective membrane and protective membrane JSR CORP JP 2010-02-10 CN disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
CN-101639628-A Radioactive linear composition for forming of coloring layer, color filter and color liquid crystal display element JSR CORP JP 2010-02-03 CN disclosed
CN-101226329-A Radiation sensitive resin composition, laminated insulating film, micro lens and preparation method thereof JSR CORP (JP) 2008-07-23 CN disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed