SCHEMBL7041079

SCHEMBL7041079

COCc1ccc(C(=O)c2ccc(COC)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.54
HTT P42858 3/20 0.50
ALDH1A1 P00352 3/20 0.50
SMN1; SMN2 Q16637 3/20 0.50
L3MBTL1 Q9Y468 1/20 0.50
MAPT P10636 3/20 0.48
LMNA P02545 3/20 0.48
HPGD P15428 2/20 0.48
ESR1 P03372 1/20 0.48
ESR2 Q92731 1/20 0.48
PKM P14618 1/20 0.48
RAB9A P51151 3/20 0.47
GAA P10253 1/20 0.47
SRD5A2 P31213 2/20 0.46
NPC1 O15118 1/20 0.46
POLB P06746 1/20 0.46
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
ACHE P22303 1/20 0.45
PPARG P37231 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11472200 0.92 ATM (0.66) ATMHTTALDH1A1SMN1; SMN2L3MBTL1
SCHEMBL11474331 0.90 MAOB (0.54) ATMHTTALDH1A1SMN1; SMN2LMNA
SCHEMBL11490185 0.90 HPGD (0.59) ATMALDH1A1L3MBTL1MAPTLMNA
SCHEMBL10709493 0.86 CES2 (0.52) ATMALDH1A1SMN1; SMN2LMNAHPGD
SCHEMBL11472881 0.85 ATM (0.43) ATMHTTALDH1A1SMN1; SMN2L3MBTL1
SCHEMBL566413 0.84 NPC1 (0.62) ALDH1A1SMN1; SMN2HPGDRAB9ANPC1
SCHEMBL1104605 0.84 KMT2A (0.61) HTTALDH1A1SMN1; SMN2L3MBTL1MAPT
SCHEMBL19901113 0.84 MAOB (0.54) HTTALDH1A1SMN1; SMN2L3MBTL1MAPT
SCHEMBL8280582 0.83 PARP10 (0.63) ALDH1A1MAPTRAB9ANPC1KMT2A
SCHEMBL2607023 0.83 LOXL2 (0.66) ALDH1A1SMN1; SMN2L3MBTL1MAPTLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240329525-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-10-03 US disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US disclosed
CN-110088680-B Double-layer photosensitive layer roll 旭化成株式会社 2022-12-30 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
US-10990008-B2 Resin composition TORAY INDUSTRIES, INC. (JP) 2021-04-27 US disclosed
US-20200409263-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-12-31 US disclosed
US-10831101-B2 Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-11-10 US disclosed
US-20190113845-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-04-18 US disclosed
US-20190086800-A1 RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2019-03-21 US disclosed
EP-0659737-B1 Catecholamine surrogates useful as beta 3 agonists BRISTOL MYERS SQUIBB CO (US) 2003-03-26 EP disclosed
EP-0659737-A2 Catecholamine surrogates useful as B3 agonists BRISTOL-MYERS SQUIBB COMPANY (US) 1995-06-28 EP disclosed
US-5122442-A Water soluble binder; photosensitive compound HOECHST CELANESE CORPORATION (US) 1992-06-16 US disclosed
EP-0212482-B1 PROCESS FOR OBTAINING NEGATIVE IMAGES FROM POSITIVE PHOTORESISTS HOECHST CELANESE CORPORATION (US) 1989-04-19 EP disclosed
EP-0106156-B1 LIGHT-SENSITIVE COMPOSITION HOECHST CELANESE CORPORATION (US) 1988-12-21 EP disclosed
EP-0212482-A2 Process for obtaining negative images from positive photoresists HOECHST CELANESE CORPORATION (US) 1987-03-04 EP disclosed
EP-0061150-B1 LIGHT-SENSITIVE POLYCONDENSATION PRODUCT, PROCESS FOR ITS PREPARATION AND LIGHT-SENSITIVE RECORDING MATERIAL CONTAINING THE SAME AMERICAN HOECHST CORPORATION (US) 1986-10-15 EP disclosed
EP-0106156-A2 Light-sensitive composition HOECHST CELANESE CORPORATION (US) 1984-04-25 EP disclosed
US-4436804-A Light-sensitive polymeric diazonium condensates and reproduction compositions and materials therewith AMERICAN HOECHST CORPORATION (US) 1984-03-13 US disclosed
EP-0061150-A1 Light-sensitive polycondensation product, process for its preparation and light-sensitive recording material containing the same AMERICAN HOECHST CORPORATION (US) 1982-09-29 EP disclosed
US-4199420-A ETHYLENICALLY UNSATURATED MONOMERS STAUFFER CHEMICAL COMPANY (US) 1980-04-22 US disclosed