SCHEMBL704114

SCHEMBL704114

CCCCO[SiH2]CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27626717 0.92
SCHEMBL26116010 0.89 THRB (0.42)
SCHEMBL9009709 0.89 THRB (0.42)
SCHEMBL1426823 0.89 THRB (0.42)
SCHEMBL17507889 0.88
SCHEMBL29991079 0.81
SCHEMBL707612 0.80
SCHEMBL705779 0.80 ADRB2 (0.39)
SCHEMBL5077487 0.78
SCHEMBL9205305 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 151 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103159866-B Preparation method of reinforced powdered rubber PETROCHINA CO LTD 2014-11-26 CN claimed
CN-103159892-A Preparation method of reinforced release agent CHINA NAT PETROLEUM CORP 2013-06-19 CN claimed
CN-103159866-A Preparation method of reinforced powdered rubber CHINA NAT PETROLEUM CORP 2013-06-19 CN claimed
US-20080300364-A1 Carbon nanotube/polyolefin composite by water-crosslinking reaction and method thereof FAR EAST UNIVERSITY (TW) 2008-12-04 US claimed
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
CN-114055975-B Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2023-05-12 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
EP-3067395-B1 ULTRAVIOLET RADIATION-CURABLE COMPOSITION, AND RECORDED MATTER SEIKO EPSON CORP (JP) 2020-10-28 EP disclosed
US-10759119-B2 Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object SEIKO EPSON CORPORATION (JP) 2020-09-01 US disclosed
CN-105093832-B Photosensitive composition, protective film and element having protective film 奇美实业股份有限公司 2019-08-30 CN disclosed
US-10392522-B2 Ultraviolet curable composition and recorded object SEIKO EPSON CORPORATION (JP) 2019-08-27 US disclosed
US-10300708-B2 Ink jet composition, housing, and ink jet method SEIKO EPSON CORPORATION (JP) 2019-05-28 US disclosed
CN-1891757-A Silica film forming material, silica film and method of manufacturing the same FUJITSU LTD (JP) 2007-01-10 CN disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
CN-1781955-A Hydrogenation catalyst composition and method for hydrogenating conjugate diene polymer TAIWAN RUBBER CO LTD (CN) 2006-06-07 CN disclosed
CN-1739190-A Fluorine-free plasma curing method for porous Low-K material AXCELIS TECH INC (US) 2006-02-22 CN disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed
EP-0954558-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR, William C. (US) 1999-11-10 EP disclosed
WO-1998026028-A1 FUEL COMPOSITIONS EXHIBITING IMPROVED FUEL STABILITY ORR WILLIAM C (US) 1998-06-18 WO disclosed