Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | LTA4H | P09960 | 2/20 | 0.35 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.33 |
| ▸ | MAOA | P21397 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.31 |
| ▸ | MTNR1A | P48039 | 4/20 | 0.30 |
| ▸ | MTNR1B | P49286 | 4/20 | 0.30 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.30 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.30 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.30 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.30 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15914634 | 0.79 | TDP1 (0.32) | CA4LMNAMAOAKDM4ECYP2D6 | |
| SCHEMBL711280 | 0.77 | CA4 (0.35) | CA4LMNALTA4HMAOAKDM4E | |
| SCHEMBL706901 | 0.76 | ALDH1A1 (0.33) | TSHR | |
| SCHEMBL1602999 | 0.76 | TDP1 (0.30) | — | |
| SCHEMBL19927499 | 0.75 | CA4 (0.42) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL704478 | 0.75 | CA4 (0.42) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL19927058 | 0.74 | — | — | |
| SCHEMBL19927143 | 0.74 | — | — | |
| SCHEMBL19927430 | 0.73 | CA4 (0.40) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL19926989 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3507104-B1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU | BRIDGESTONE CORP (JP) | 2024-03-27 | — | — | EP | disclosed |
| CN-109641482-B | Preparation of cis-1, 4-polydienes having multiple silane functional groups prepared by in situ hydrosilylation of polymer glues | 株式会社普利司通 | 2021-11-05 | — | — | CN | disclosed |
| US-10975178-B2 | Production of cis-1,4-polydienes with multiple silane functional groups prepared by in-situ hydrosilylation of polymer cement | BRIDGESTONE CORPORATION (JP) | 2021-04-13 | — | — | US | disclosed |
| US-20190211120-A1 | Production Of Cis-1,4-Polydienes With Multiple Silane Functional Groups Prepared By In-Situ Hydrosilylation Of Polymer Cement | BRIDGESTONE CORPORATION (JP) | 2019-07-11 | — | — | US | disclosed |
| EP-3507104-A1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU | Bridgestone Corporation (JP) | 2019-07-10 | — | — | EP | disclosed |
| WO-2018045291-A1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BY IN-SITU HYDROSILYLATION OF POLYMER CEMENT | BRIDGESTONE CORPORATION (JP) | 2018-03-08 | — | — | WO | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |