Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA4 | P22748 | 1/20 | 0.42 |
| ▸ | LMNA | P02545 | 1/20 | 0.40 |
| ▸ | LTA4H | P09960 | 3/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.39 |
| ▸ | PTGS1 | P23219 | 2/20 | 0.36 |
| ▸ | MAOA | P21397 | 1/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | KCNA3 | P22001 | 1/20 | 0.33 |
| ▸ | MTNR1A | P48039 | 4/20 | 0.32 |
| ▸ | MTNR1B | P49286 | 4/20 | 0.32 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.32 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.32 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.32 |
| ▸ | ADRB3 | P13945 | 1/20 | 0.32 |
| ▸ | CA5A | P35218 | 1/20 | 0.32 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19927436 | 0.89 | CA4 (0.42) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL19927310 | 0.83 | LTA4H (0.38) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL28665031 | 0.82 | CA4 (0.37) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL704613 | 0.81 | CA4 (0.39) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL2229317 | 0.81 | CA4 (0.39) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL19927499 | 0.80 | CA4 (0.42) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL19927430 | 0.78 | CA4 (0.40) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL6143132 | 0.78 | LMNA (0.39) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL2170644 | 0.76 | CA4 (0.34) | CA4LMNALTA4HTSHRPTGS1 | |
| SCHEMBL704955 | 0.75 | CA4 (0.37) | CA4LMNALTA4HTSHRPTGS1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3507104-B1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU | BRIDGESTONE CORP (JP) | 2024-03-27 | — | — | EP | disclosed |
| CN-115926169-B | Method for producing polysiloxane compound, composition, and molded article | 三菱瓦斯化学株式会社 | 2024-03-22 | — | — | CN | disclosed |
| US-20230357511-A1 | PRODUCTION METHOD FOR POLYSILOXANE, COMPOSITION INCLUDING POLYSILOXANE, AND MOLDED BODY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-11-09 | — | — | US | disclosed |
| US-20230331925-A1 | THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-10-19 | — | — | US | disclosed |
| WO-2023171578-A1 | THERMOPLASTIC RESIN, METHOD FOR PRODUCING SAME, THERMOPLASTIC RESIN COMPOSITION AND MOLDED BODY | 三菱瓦斯化学株式会社 | 2023-09-14 | — | — | WO | disclosed |
| EP-4219590-A1 | PRODUCTION METHOD FOR POLYSILOXANE, COMPOSITION INCLUDING POLYSILOXANE, AND MOLDED BODY | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-08-02 | — | — | EP | disclosed |
| EP-4219589-A1 | THERMOPLASTIC RESIN, COMPOSITION, MOLDED ARTICLE, OPTICAL LENS, AND METHOD FOR PRODUCING THERMOPLASTIC RESIN | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2023-08-02 | — | — | EP | disclosed |
| CN-116390968-A | Thermoplastic resin, composition, molded body, optical lens, and method for producing thermoplastic resin | 三菱瓦斯化学株式会社 | 2023-07-04 | — | — | CN | disclosed |
| CN-116348530-A | Method for producing polysiloxane, composition containing polysiloxane, and molded body | 三菱瓦斯化学株式会社 | 2023-06-27 | — | — | CN | disclosed |
| CN-115926169-A | Method for producing polycarbonate copolymer and polysiloxane compound, polycarbonate copolymer, polysiloxane compound, composition, and molded article | 三菱瓦斯化学株式会社 | 2023-04-07 | — | — | CN | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| US-20100248477-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating a substrate therewith | YOKOI SHIGERU | 2010-09-30 | — | — | US | disclosed |
| US-20100155121-A1 | SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | FUJITSU LIMITED (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100051582-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2010-03-04 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090156005-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2009-06-18 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060241012-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | YOKOI SHIGERU | 2006-10-26 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| US-4831091-A | USING A COORDINATION CATALYST CONTAINING A SILANETRIOL OR -DIOL AS WELL AS AN AROMATIC ESTSER; ODORLESS; STEREOSPECIFIC; PARTICLE SIZES | CHISSO CORPORATION (JP) | 1989-05-16 | — | — | US | disclosed |