SCHEMBL705234

SCHEMBL705234

CCC[Si](OCC)(c1ccccc1)c1ccccc1

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.32
KMT2A Q03164 1/20 0.32
TP53 P04637 1/20 0.31
KDM4E B2RXH2 1/20 0.31
ALDH1A1 P00352 1/20 0.31
GAA P10253 1/20 0.31
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL647413 0.91 LTA4H (0.34) LTA4HTP53KDM4EALDH1A1HPGD
SCHEMBL3481751 0.88 LTA4H (0.36) LTA4HALDH1A1
SCHEMBL646950 0.88 TSHR (0.33) LTA4HTP53HPGD
SCHEMBL703253 0.88 LTA4H (0.32) LTA4HTP53HPGD
SCHEMBL7910674 0.86 LTA4H (0.37) LTA4H
SCHEMBL702331 0.86 KMT2A (0.36) LTA4HKMT2ATP53ALDH1A1GAA
SCHEMBL708759 0.83 LTA4H (0.34) LTA4HTP53KDM4EALDH1A1HPGD
SCHEMBL646811 0.83 LTA4H (0.34) LTA4HKMT2ATP53KDM4EALDH1A1
SCHEMBL702747 0.82 LTA4H (0.43) LTA4HALDH1A1
SCHEMBL10612613 0.81 MAOA (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114085382-A Hydrogen-containing poly titanium boron siloxane flame retardant, and preparation method and application thereof 铨盛聚碳科技股份有限公司 2022-02-25 CN disclosed
CN-109438633-A A kind of organosilicon toughener and its synthetic method with anti-drop effect 广东优科艾迪高分子材料有限公司 2019-03-08 CN disclosed
CN-109337025-A A kind of anti-dripping agent and its synthetic method with toughening effect 广东优科艾迪高分子材料有限公司 2019-02-15 CN disclosed
CN-109320772-A A kind of anti-dripping agent and preparation method thereof containing organosilicon and inorganic silicon 广东优科艾迪高分子材料有限公司 2019-02-12 CN disclosed
CN-109320674-A A kind of anti-dripping agent and preparation method thereof containing PTFE and organosilicon 广东优科艾迪高分子材料有限公司 2019-02-12 CN disclosed
CN-109320937-A A kind of organic silicon fibre retardant and preparation method thereof based on poroid inorganic matter 铨盛(云浮)新型聚合物有限公司 2019-02-12 CN disclosed
CN-109306169-A A kind of hydridization organic matter and the organic silicon fibre retardant of nano silica and preparation method thereof 铨盛(云浮)新型聚合物有限公司 2019-02-05 CN disclosed
CN-109293853-A A kind of organic silicon fibre retardant and preparation method thereof containing epoxy group 铨盛聚碳科技股份有限公司 2019-02-01 CN disclosed
CN-109293856-A A kind of the organosilicon toughener and its synthetic method of polymer overmold nano-inorganic substance 铨盛聚碳科技股份有限公司 2019-02-01 CN disclosed
CN-109233160-A A kind of organic silicon fibre retardant and preparation method thereof containing PTFE and nano silica 铨盛聚碳科技股份有限公司 2019-01-18 CN disclosed
US-20060269724-A1 Comprising silica particles and at least one binder compound; good mechanical strength and abrasion resistance ASAHI KASEI KABUSHIKI KAISHA (JP) 2006-11-30 US disclosed
CN-1651159-A Cleaning CVD chambers following deposition of porogen-containing materials AIR PROD & CHEM (US) 2005-08-10 CN disclosed
EP-1058274-B1 Composition for film formation and material for insulating film formation JSR CORP (JP) 2005-07-27 EP disclosed
US-20040077757-A1 Coating composition for use in producing an insulating thin film ASAHI KASEI KABUSHIKI KAISHA (JP) 2004-04-22 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
EP-1058274-A1 Composition for film formation and material for insulating film formation JSR Corporation (JP) 2000-12-06 EP disclosed
US-6096836-A OXYGEN CONTAINING AROMATIC CATALYST AND ALUMINUM COMPOUND KABUSHIKI KAISHA TOSHIBA (JP) 2000-08-01 US disclosed
US-5811497-A STORAGE STABLE EPOXY RESINS ACTIVATE THE CURING WHEN APPLYING THE HEAT; FLEXIBILITY, DIELECTRIC, MECHANICAL STRENGTH KABUSHIKI KAISHA TOSHIBA (JP) 1998-09-22 US disclosed
US-5439746-A Formed by coating or impregnating a reinforcement sheet and curing; mechanical strength; corrosion and heat resistance; electrical properties KABUSHIKI KAISHA TOSHIBA (JP) 1995-08-08 US disclosed