SCHEMBL7053292

SCHEMBL7053292

CCCC(CC)([Si](OC)(OC)OC)[Si](OC)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14880292 0.70
SCHEMBL7622006 0.70
SCHEMBL233449 0.70
SCHEMBL28742563 0.70
SCHEMBL28251609 0.70 TSHR (0.38)
SCHEMBL26923405 0.68
SCHEMBL3912961 0.66 LMNA (0.31)
SCHEMBL12031999 0.65 ALDH1A1 (0.33)
SCHEMBL31747937 0.65
SCHEMBL231392 0.64 FDPS (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2003035252-A1 CHEMICAL MODIFICATION OF PARTICLE SURFACES BY CROSS-LINKING MERCK PATENT GMBH (DE) 2003-05-01 WO claimed
EP-2798010-A1 MULTI-COMPONENT TYPE CURABLE SILICONE RUBBER COMPOSITION, MATERIAL FOR ELECTRONIC PARTS USING SUCH, AND SOLAR CELL MODULE Dow Corning Toray Co., Ltd. (JP) 2014-11-05 EP disclosed
EP-2768885-A1 MULTI-COMPONENT ROOM-TEMPERATURE-CURABLE SILICONE ELASTOMER COMPOSITION Dow Corning Toray Co., Ltd. (JP) 2014-08-27 EP disclosed
WO-2013100175-A1 MULTI-COMPONENT TYPE CURABLE SILICONE RUBBER COMPOSITION, MATERIAL FOR ELECTRONIC PARTS USING SUCH, AND SOLAR CELL MODULE DOW CORNING TORAY CO., LTD. (JP) 2013-07-04 WO disclosed
WO-2013058293-A1 MULTI-COMPONENT ROOM-TEMPERATURE-CURABLE SILICONE ELASTOMER COMPOSITION DOW CORNING TORAY CO., LTD. (JP) 2013-04-25 WO disclosed
WO-2003035252-A1 CHEMICAL MODIFICATION OF PARTICLE SURFACES BY CROSS-LINKING MERCK PATENT GMBH (DE) 2003-05-01 WO disclosed