SCHEMBL705387

SCHEMBL705387

CCCC[Si](OCCC)(OCCC)c1ccc([Si](CCCC)(OCCC)OCCC)cc1

nearest known ligand 0.37

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
AR P10275 1/20 0.37
NR1H2 P55055 1/20 0.35
NR1H3 Q13133 1/20 0.35
CYP3A4 P08684 1/20 0.32
CYP2D6 P10635 1/20 0.32
ADRB2 P07550 1/20 0.31
ADRB1 P08588 1/20 0.31
ADRB3 P13945 1/20 0.31
LTA4H P09960 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL706661 0.92 AR (0.37) ARNR1H2NR1H3CYP3A4CYP2D6
SCHEMBL28062793 0.91 MGLL (0.35) ARNR1H2NR1H3CYP2D6
SCHEMBL28827525 0.91 SMN1; SMN2 (0.35) ARNR1H2NR1H3
SCHEMBL706755 0.90 LTA4H (0.39) CYP3A4CYP2D6ADRB2ADRB1LTA4H
SCHEMBL704496 0.87 NR1H2 (0.33) NR1H2NR1H3
SCHEMBL703527 0.85 AR (0.38) ARNR1H2NR1H3
SCHEMBL20483784 0.85 LTA4H (0.40) CYP3A4ADRB2ADRB1LTA4H
SCHEMBL702211 0.84 LTA4H (0.36) CYP2D6LTA4H
SCHEMBL706699 0.84 LTA4H (0.36) CYP2D6LTA4H
SCHEMBL19470870 0.83 LTA4H (0.39) CYP3A4ADRB2ADRB1LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed