SCHEMBL7054974

SCHEMBL7054974

CNc1ccc(C2(c3ccc(NC)cc3)c3ccccc3-c3ccc(C)cc32)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.45
ESR2 Q92731 1/20 0.45
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
LMNA P02545 2/20 0.45
MAPT P10636 2/20 0.45
KDM4E B2RXH2 1/20 0.45
OPRK1 P41145 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
PDK2 Q15119 8/20 0.44
GFER P55789 1/20 0.42
POLB P06746 1/20 0.42
ELANE P08246 1/20 0.35
TSHR P16473 1/20 0.34
PTPRC P08575 1/20 0.34
KIF11 P52732 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
RPS6KA2 Q15349 1/20 0.33
APP P05067 2/20 0.32
SNCA P37840 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29580425 1.00 ESR1 (0.45) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL6538799 0.87 MEN1 (0.57) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL30771578 0.87 MEN1 (0.57) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL18923291 0.84 PDK2 (0.51) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL7055099 0.81 LMNA (0.71) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL9175901 0.81 ESR1 (0.55) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL29579958 0.81 LMNA (0.71) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL7051991 0.81 PDK2 (0.45) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL29579557 0.81 PDK2 (0.45) ESR1ESR2MEN1KMT2ALMNA
SCHEMBL7055767 0.81 ESR1 (0.51) ESR1ESR2MEN1KMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2900726-B1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LTD (GB) 2020-04-08 EP claimed
US-20150210847-A1 RESIN COMPOSITION AND COMPOSITE STRUCTURE CONTAINING RESIN HEXCEL COMPOSITES LIMITED (GB) 2015-07-30 US claimed
US-11370908-B2 Curable compositions and related methods 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-06-28 US disclosed
US-20220080553-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M INNOVATIVE PROPERTIES CO (US) 2022-03-17 US disclosed
US-20220001514-A1 ABRASIVE ARTICLE WITH MICROPARTICLE-COATED ABRASIVE GRAINS 3M INNOVATIVE PROPERTIES COMPANY 2022-01-06 US disclosed
US-20210363289-A1 RESIN COMPOSITIONS AND RESIN INFUSION PROCESS CYTEC INDUSTRIES INC. (US) 2021-11-25 US disclosed
EP-3898097-A1 RAPID CURING BONDED ABRASIVE ARTICLE PRECURSOR 3M Innovative Properties Company (US) 2021-10-27 EP disclosed
US-11111333-B2 Resin compositions and resin infusion process CYTEC INDUSTRIES INC. (US) 2021-09-07 US disclosed
US-11078358-B2 Curable composition including epoxy resin and curable solid filler 3M INNOVATIVE PROPERTIES COMPANY (US) 2021-08-03 US disclosed
EP-3814398-A1 CURABLE COMPOSITIONS AND RELATED METHODS 3M Innovative Properties Company (US) 2021-05-05 EP disclosed
US-20210102061-A1 CURABLE COMPOSITIONS AND RELATED METHODS 3M INNOVATIVE PROPERTIES COMPANY 2021-04-08 US disclosed
EP-0591313-B1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING & MFG (US) 1997-04-02 EP disclosed
WO-1997011112-A1 EPOXY RESIN COMPOSITIONS, PREPREGS, CURED COMPOSITES, AND METHODS OF MAKING THE SAME MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1997-03-27 WO disclosed
US-5432010-A Binder resin for resin transfer molding preforms, preforms made therewith, and a method for preparing such preforms MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-07-11 US disclosed
US-5369192-A Aromatic epoxide with bis(aminophenyl)fluorene compound curing agent MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1994-11-29 US disclosed
EP-0591313-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS. MINNESOTA MINING & MFG (US) 1994-04-13 EP disclosed
WO-1993000675-A1 VIBRATION DAMPING CONSTRUCTIONS USING AROMATIC EPOXY HIGH TEMPERATURE DAMPING MATERIALS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-07 WO disclosed
EP-0203828-B1 EPOXY RESIN CURING AGENT, CURING PROCESS AND COMPOSITION CONTAINING IT MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1990-03-28 EP disclosed
US-4684678-A POLYEPOXIDES OF HIGH GLASS TRANSITION TEMPERATURE AND DUCTILITY MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1987-08-04 US disclosed
EP-0203828-A1 Epoxy resin curing agent, curing process and composition containing it MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1986-12-03 EP disclosed