SCHEMBL7056918

SCHEMBL7056918

CCCCCCCC[SiH](CCCCCCCC)OCC

nearest known ligand 0.42

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.42
THRB P10828 1/20 0.42
DNM1 Q05193 6/20 0.33
ALDH1A1 P00352 3/20 0.33
LMNA P02545 2/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
LSS P48449 1/20 0.33
HSD17B10 Q99714 1/20 0.33
SLC22A1 O15245 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28616633 1.00 TSHR (0.42) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL6057151 1.00 TSHR (0.42) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL4623058 0.97 TSHR (0.37) TSHRTHRBLMNASLC22A1
SCHEMBL28173108 0.90 TSHR (0.38) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL6303418 0.90 TSHR (0.42) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL340718 0.89 TSHR (0.33) TSHRTHRBLMNA
SCHEMBL3482469 0.84 LMNA (0.30) TSHRLMNA
SCHEMBL9547135 0.82 THRB (0.40) TSHRTHRBMEN1KMT2A
SCHEMBL6298300 0.81 TSHR (0.44) TSHRTHRBDNM1ALDH1A1LMNA
SCHEMBL23658246 0.79 TSHR (0.42) TSHRTHRBDNM1ALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12473474-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2025-11-18 US disclosed
CN-118401615-A Metal pigment composition 旭化成株式会社 2024-07-26 CN disclosed
US-11952516-B2 Addition curable silicone adhesive compositions MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-04-09 US disclosed
CN-113518794-B Addition-curable silicone adhesive composition 迈图高新材料公司 2023-12-22 CN disclosed
US-20230047848-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2023-02-16 US disclosed
EP-4073193-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2022-10-19 EP disclosed
CN-115066475-A Addition curable silicone adhesive composition 迈图高新材料公司 2022-09-16 CN disclosed
US-20220119690-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. 2022-04-21 US disclosed
EP-3914638-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS Momentive Performance Materials Inc. (US) 2021-12-01 EP disclosed
CN-113518794-A Addition-curable silicone adhesive composition 迈图高新材料公司 2021-10-19 CN disclosed
WO-2021118582-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2021-06-17 WO disclosed
WO-2020153947-A1 ADDITION CURABLE SILICONE ADHESIVE COMPOSITIONS MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2020-07-30 WO disclosed
EP-1006118-B1 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond DOW CORNING ASIA LTD (JP) 2003-05-07 EP disclosed
US-6191220-B1 REACTING POLYMER HAVING OLEFINIC OR ACETYLENIC UNSATURATED GROUPS WITH HYDRIDE (HYDROCARBONOXY) SILANE IN PRESENCE OF PLATINUM OR PLATINUM COMPOUND CATALYST AND SILYLATED CARBOXYLIC ACID TO FORM HYDROCARBONOXYSILYL FUNCTIONAL POLYMER DOW CORNING ASIA, LTD. (JP) 2001-02-20 US disclosed
US-6111126-A Method for synthesizing organosilicon compounds that contain a functional group bonded to silicon across the Si-C bond DOW CORNING ASIA, LTD. (JP) 2000-08-29 US disclosed
EP-1006118-A2 Method for synthesizing organosilicon compounds that contain a group bonded to silicon across the SI-C bond Dow Corning Asia, Ltd. (JP) 2000-06-07 EP disclosed
US-6048994-A Selective hydrosilylation method using hydrido (hydrocarbonoxy) silane DOW CORNING ASIA, LTD. (JP) 2000-04-11 US disclosed
US-5994573-A Method for making triarylamine compounds having hydrocarbonoxysilyl groups DOW CORNING ASIA, LTD. (JP) 1999-11-30 US disclosed
US-5986124-A Method for making compounds containing hydrocarbonoxysilyi groups by hydrosilylation using hydrido (hydrocarbonoxy) silane compounds DOW CORNING ASIA, LTD. (JP) 1999-11-16 US disclosed