Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ATM | Q13315 | 1/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | RIPK1 | Q13546 | 2/20 | 0.36 |
| ▸ | SLC6A4 | P31645 | 3/20 | 0.36 |
| ▸ | SLC6A3 | Q01959 | 3/20 | 0.36 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.36 |
| ▸ | AOC3 | Q16853 | 2/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.34 |
| ▸ | CACNA1F | O60840 | 1/20 | 0.34 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.34 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.34 |
| ▸ | ADRA2B | P18089 | 1/20 | 0.34 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.34 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.34 |
| ▸ | HRH1 | P35367 | 1/20 | 0.34 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.34 |
| ▸ | CACNA1D | Q01668 | 1/20 | 0.34 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.34 |
| ▸ | CACNA1S | Q13698 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7438325 | 0.81 | ATM (0.41) | ATML3MBTL1RIPK1SLC6A4SLC6A3 | |
| SCHEMBL2127629 | 0.81 | ATM (0.41) | ATML3MBTL1RIPK1SLC6A4SLC6A3 | |
| SCHEMBL12344306 | 0.79 | ATM (0.40) | ATML3MBTL1RIPK1SLC6A4SLC6A3 | |
| SCHEMBL11911981 | 0.79 | ATM (0.40) | ATML3MBTL1RIPK1SLC6A4SLC6A3 | |
| SCHEMBL14663964 | 0.79 | ATM (0.40) | ATML3MBTL1RIPK1SLC6A4SLC6A3 | |
| SCHEMBL230734 | 0.78 | KMT2A (0.35) | RIPK1HRH1DPP4KMT2A | |
| SCHEMBL7701248 | 0.77 | ATM (0.39) | ATML3MBTL1RIPK1SLC6A4SLC6A3 | |
| SCHEMBL10713851 | 0.77 | TSHR (0.39) | MAPK1DPP4 | |
| SCHEMBL11786688 | 0.77 | ATM (0.43) | ATML3MBTL1RIPK1SLC6A4SLC6A3 | |
| SCHEMBL5570358 | 0.77 | LMNA (0.38) | ATML3MBTL1RIPK1AOC3TAAR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12109812-B2 | Ink jet printing method and ink jet printing apparatus | SEIKO EPSON CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| CN-114055975-B | Ink jet recording method and ink jet recording apparatus | 精工爱普生株式会社 | 2023-05-12 | — | — | CN | disclosed |
| US-20220032618-A1 | Ink Jet Printing Method And Ink Jet Printing Apparatus | SEIKO EPSON CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| US-10259208-B2 | Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2019-04-16 | — | — | US | disclosed |
| US-9579852-B2 | Method for manufacturing three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2017-02-28 | — | — | US | disclosed |
| US-20160339602-A1 | METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE | SEIKO EPSON CORPORATION (JP) | 2016-11-24 | — | — | US | disclosed |
| US-20160263829-A1 | THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM | SEIKO EPSON CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-9415545-B2 | Method of manufacturing three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2016-08-16 | — | — | US | disclosed |
| US-20160107385-A1 | THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2016-04-21 | — | — | US | disclosed |
| US-20150273765-A1 | METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE AND THREE-DIMENSIONAL STRUCTURE | SEIKO EPSON CORPORATION (JP) | 2015-10-01 | — | — | US | disclosed |
| US-7659357-B2 | Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed | FUJITSU LIMITED (JP) | 2010-02-09 | — | — | US | disclosed |
| US-20090077798-A1 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20090071706-A1 | METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-19 | — | — | US | disclosed |
| US-7500895-B2 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20080317943-A1 | METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | SEIKO EPSON CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080311285-A1 | CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD | SEIKO EPSON CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20070026689-A1 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2007-02-01 | — | — | US | disclosed |
| US-20060127563-A1 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20060019034-A1 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20050287392-A1 | Organic electroluminescent device, method for producing the same, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2005-12-29 | — | — | US | disclosed |