SCHEMBL707144

SCHEMBL707144

CCC(c1ccccc1)[SiH](Cl)Cl

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.46
TSHR P16473 2/20 0.39
MIF P14174 1/20 0.38
HKDC1 Q2TB90 1/20 0.37
TRPA1 O75762 1/20 0.37
TAAR1 Q96RJ0 3/20 0.37
HTR2A P28223 3/20 0.37
HRH1 P35367 2/20 0.37
AOC3 Q16853 1/20 0.36
NOS3 P29474 1/20 0.36
NOS2 P35228 1/20 0.36
TDP1 Q9NUW8 1/20 0.35
POLB P06746 1/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
KDM4E B2RXH2 1/20 0.35
ALDH1A1 P00352 1/20 0.35
HPGD P15428 1/20 0.35
HSD17B10 Q99714 1/20 0.35
SRC P12931 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL524106 0.83 AOC3 (0.42) LMNATSHRTAAR1HTR2AHRH1
SCHEMBL1403768 0.79 POLB (0.41) LMNAHTR2AHRH1AOC3POLB
SCHEMBL27934269 0.79 LMNA (0.48) LMNAMIFHKDC1TRPA1TAAR1
SCHEMBL708302 0.79 LMNA (0.48) LMNAMIFHKDC1TRPA1TAAR1
SCHEMBL19470835 0.78 SIGMAR1 (0.41) HTR2APOLBKDM4EALDH1A1
SCHEMBL27912798 0.78 LMNA (0.39) LMNATSHRMIFHKDC1TRPA1
SCHEMBL10606181 0.77 LMNA (0.52) LMNATSHRMIFHKDC1TRPA1
SCHEMBL22283485 0.77 LMNA (0.46) LMNAMIFHKDC1TRPA1TAAR1
SCHEMBL707339 0.77 LMNA (0.46) LMNAMIFHKDC1TRPA1TAAR1
SCHEMBL20483517 0.77 HTR2A (0.41) HTR2AMEN1KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115322509-B Composite Janus particle, manufacturing method thereof, coating and laminated body 清华大学 2023-07-25 CN disclosed
CN-115322509-A Composite Janus particle, method for producing same, coating layer, and laminate 清华大学 2022-11-11 CN disclosed
CN-107075255-B Encapsulating material composition for LED 日产化学工业株式会社 2020-05-22 CN disclosed
US-10066059-B2 Sealing material composition for LED NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2018-09-04 US disclosed
CN-103249762-A Addition-curable metallosiloxane compound DAICEL CORP 2013-08-14 CN disclosed
US-8124239-B2 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2012-02-28 US disclosed
US-20100155121-A1 SILICA FILM FORMING MATERIAL, SILICA FILM AND METHOD OF MANUFACTURING THE SAME, MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME FUJITSU LIMITED (JP) 2010-06-24 US disclosed
US-7659357-B2 Precursor organosilicon polymer of 1,2-Bis(dimethylethoxysilyl)ethane, 1,4-bis(dimethylethoxysilyl)benzene, tetraethoxysilane, methyltriethoxysilane, phenyltriethoxysilane; dielectric (DE) films having etching/chemical/moisture resistance; adhesion; low DE constant; minimal wiring delay; high speed FUJITSU LIMITED (JP) 2010-02-09 US disclosed
US-20070026689-A1 Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same FUJITSU LIMITED (JP) 2007-02-01 US disclosed
EP-0263673-A2 Addition reaction of hydrosilanes with unsaturated hydrocarbons Toray Silicone Company, Ltd. (JP) 1988-04-13 EP disclosed