SCHEMBL7082007

SCHEMBL7082007

C=CCOC(=O)C=CC(=O)OCc1ccccc1

nearest known ligand 0.70

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 5/20 0.70
LMNA P02545 1/20 0.61
AKR1B10 O60218 2/20 0.56
AKR1B1 P15121 2/20 0.56
CA12 O43570 2/20 0.56
CA4 P22748 2/20 0.56
CA6 P23280 2/20 0.56
CA5A P35218 2/20 0.56
CA7 P43166 2/20 0.56
CA9 Q16790 2/20 0.56
CA14 Q9ULX7 2/20 0.56
CA5B Q9Y2D0 2/20 0.56
TTR P02766 1/20 0.51
ALDH1A1 P00352 6/20 0.50
CYP3A4 P08684 1/20 0.50
POLB P06746 1/20 0.50
MAPT P10636 1/20 0.47
CACNA1B Q00975 1/20 0.47
APBA1 Q02410 1/20 0.47
MAPK1 P28482 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7088982 1.00 HCAR2 (0.70) HCAR2LMNAAKR1B10AKR1B1CA12
SCHEMBL7082004 1.00 HCAR2 (0.70) HCAR2LMNAAKR1B10AKR1B1CA12
SCHEMBL28117903 0.90 HCAR2 (0.56) HCAR2LMNAAKR1B10AKR1B1CA12
SCHEMBL337503 0.88 HCAR2 (0.89) HCAR2LMNAAKR1B10AKR1B1CA12
SCHEMBL337504 0.88 HCAR2 (0.89) HCAR2LMNAAKR1B10AKR1B1CA12
SCHEMBL357565 0.88 HCAR2 (0.89) HCAR2LMNAAKR1B10AKR1B1CA12
SCHEMBL27659194 0.86 HCAR2 (0.85) HCAR2LMNAAKR1B10AKR1B1CA12
Styrene SCHEMBL28035979 0.83 LMNA (0.71) HCAR2LMNAAKR1B10AKR1B1CA12
Styrene SCHEMBL28035591 0.83 LMNA (0.71) HCAR2LMNAAKR1B10AKR1B1CA12
SCHEMBL8397728 0.83 CYP3A4 (0.53) HCAR2LMNAAKR1B10AKR1B1CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1331494-A1 COMPOSITION FOR OPTICAL MATERIAL, OPTICAL MATERIAL, AND PLASTIC LENS NOF CORPORATION (JP) 2003-07-30 EP disclosed
US-6437069-B1 Curable resin composition DAISO CO., LTD. (JP) 2002-08-20 US disclosed