SCHEMBL710309

SCHEMBL710309

Nc1cc(-c2ccc(C(=O)O)c(N)c2)ccc1C(=O)O

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 1/20 0.75
KDM4E B2RXH2 5/20 0.68
KMT2A Q03164 4/20 0.68
GFER P55789 1/20 0.68
RXFP1 Q9HBX9 1/20 0.68
ALDH1A1 P00352 5/20 0.57
HPGD P15428 1/20 0.57
HSD17B10 Q99714 1/20 0.57
TDP1 Q9NUW8 4/20 0.55
CYP3A4 P08684 2/20 0.55
ALOX15 P16050 1/20 0.55
IDO1 P14902 1/20 0.52
HNF4A P41235 2/20 0.50
ACMSD Q8TDX5 2/20 0.50
MAPT P10636 4/20 0.48
MEN1 O00255 3/20 0.48
MCL1 Q07820 3/20 0.48
THRB P10828 2/20 0.48
USP2 O75604 1/20 0.48
POLB P06746 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29436316 1.00 PPM1B (0.75) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL23499274 0.98 PPM1B (0.79) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL29908977 0.98 PPM1B (0.79) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL17177763 0.96 PPM1B (0.70) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL30314350 0.96 PPM1B (0.70) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL2575452 0.92 PPM1B (0.71) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL17938299 0.92 KDM4E (0.84) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL30456877 0.92 PPM1B (0.71) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL6851164 0.90 PPM1B (0.74) PPM1BKDM4EKMT2AGFERRXFP1
SCHEMBL30504245 0.90 PPM1B (0.69) PPM1BKDM4EKMT2AGFERRXFP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 173 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118344670-A Halogen-free flame-retardant modified plastic master batch and preparation method thereof 东莞国科新材料科技有限公司 2024-07-16 CN claimed
CN-118016859-A Composite positive electrode material, preparation method and application thereof 天津巴莫科技有限责任公司 2024-05-10 CN claimed
CN-108070089-A A kind of preparation method of the zirconium-based metallic organic framework material rich in zirconium ion 中国科学院大连化学物理研究所 2018-05-25 CN claimed
US-20250257265-A1 LIQUID CRYSTAL ALIGNING AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT NISSAN CHEMICAL CORPORATION (JP) 2025-08-14 US disclosed
WO-2025127092-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2025-06-19 WO disclosed
WO-2025121189-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2025-06-12 WO disclosed
US-20250171590-A1 POLYIMIDE PRECURSOR FOR DISPLAY SUBSTRATE, POLYIMIDE FILM FOR DISPLAY SUBSTRATE, AND DISPLAY SUBSTRATE UBE CORPORATION (JP) 2025-05-29 US disclosed
US-20250163218-A1 POLYIMIDE PRECURSOR FOR DISPLAY SUBSTRATE, POLYIMIDE FILM FOR DISPLAY SUBSTRATE, AND DISPLAY SUBSTRATE UBE CORPORATION (JP) 2025-05-22 US disclosed
WO-2025105278-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2025-05-22 WO disclosed
WO-2025105279-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2025-05-22 WO disclosed
US-20250145888-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT NISSAN CHEMICAL CORPORATION (JP) 2025-05-08 US disclosed
US-20030082925-A1 Comprises polyamideetherimide or polyether amide; for use as coating material, adhesive and stress releasing material; controlled elasticity; dielectrics; electronics HITACHI CHEMICAL CO., LTD. (JP) 2003-05-01 US disclosed
US-20030026998-A1 Atomic oxygen-resistant film UBE INDUSTRIES, LTD. (JP) 2003-02-06 US disclosed
US-6468639-B2 PLATING RESISTANT AND PROTECTIVE INSULATING FILM IS ACHIEVED WITH A COATING MATERIAL OF A SINGLE TYPE OF INSULATING MATERIAL UBE INDUSTRIES, LTD. (JP) 2002-10-22 US disclosed
US-6461738-B2 HEAT AND SOLVENT RESISTANCE UBE INDUSTRIES, INC. (JP) 2002-10-08 US disclosed
US-20020076548-A1 SINGLE-APPLICATION POLYIMIDOSILOXANE-BASED COATING MATERIAL AND CURED FILM UBE INDUSTRIES, LTD. (JP) 2002-06-20 US disclosed
US-20020001763-A1 Photosensitive resin compositions, insulating films, and processes for formation of the films UBE INDUSTRIES, LTD. 2002-01-03 US disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed
US-20010020081-A1 Polyimide-based insulating film composition, insulating film and insulating film-forming method UBE INDUSTRIES, LTD. (JP) 2001-09-06 US disclosed
US-6117510-A SUPPORT FILMS WITH POLYIMIDOSILOXANE COPOLYMER COATINGS UBE INDUSTRIES, LTD. (JP) 2000-09-12 US disclosed