Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PDCD1 | Q15116 | 2/20 | 0.37 |
| ▸ | CD274 | Q9NZQ7 | 2/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | HTR7 | P34969 | 1/20 | 0.34 |
| ▸ | USP7 | Q93009 | 2/20 | 0.33 |
| ▸ | GRIN2D | O15399 | 2/20 | 0.33 |
| ▸ | GRIN3B | O60391 | 2/20 | 0.33 |
| ▸ | GRIN1 | Q05586 | 2/20 | 0.33 |
| ▸ | GRIN2A | Q12879 | 2/20 | 0.33 |
| ▸ | GRIN2B | Q13224 | 2/20 | 0.33 |
| ▸ | GRIN2C | Q14957 | 2/20 | 0.33 |
| ▸ | GRIN3A | Q8TCU5 | 2/20 | 0.33 |
| ▸ | DPP4 | P27487 | 1/20 | 0.33 |
| ▸ | GCGR | P47871 | 1/20 | 0.33 |
| ▸ | SLC5A2 | P31639 | 1/20 | 0.33 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.33 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4508202 | 0.86 | ALDH1A1 (0.36) | PDCD1CD274ALDH1A1HTR7GRIN2D | |
| SCHEMBL28276813 | 0.82 | GCGR (0.42) | PDCD1CD274GCGR | |
| SCHEMBL28296260 | 0.82 | DPP4 (0.46) | PDCD1CD274ALDH1A1GRIN2DGRIN3B | |
| SCHEMBL6423012 | 0.82 | LMNA (0.41) | PDCD1CD274ALDH1A1ADRB2HPGD | |
| SCHEMBL5889004 | 0.82 | GABRA1 (0.38) | PDCD1CD274ALDH1A1GRIN2DGRIN3B | |
| SCHEMBL29644323 | 0.81 | MAOB (0.38) | PDCD1CD274ALDH1A1GRIN2DGRIN3B | |
| SCHEMBL29206317 | 0.81 | MAOB (0.38) | PDCD1CD274ALDH1A1GRIN2DGRIN3B | |
| SCHEMBL9806251 | 0.80 | PDCD1 (0.47) | PDCD1CD274ALDH1A1HTR7USP7 | |
| SCHEMBL6426096 | 0.80 | ALDH1A1 (0.41) | ALDH1A1 | |
| SCHEMBL28518728 | 0.79 | GCGR (0.38) | USP7DPP4GCGR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117720787-A | Flexible metal clad laminate and method of making the same | 科腾聚合物荷兰有限责任公司 | 2024-03-19 | — | — | CN | disclosed |
| CN-112368311-B | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-11-03 | — | — | CN | disclosed |
| CN-112020523-B | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-10-24 | — | — | CN | disclosed |
| CN-116056885-A | Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2023-05-02 | — | — | CN | disclosed |
| CN-111620982-B | Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same | 南亚新材料科技股份有限公司 | 2023-02-10 | — | — | CN | disclosed |
| CN-114555357-A | Metal-clad laminate, wiring board, metal foil with resin, and resin composition | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114555360-A | Copper-clad laminate, wiring board, and resin-attached copper foil | 松下知识产权经营株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-114423602-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-04-29 | — | — | CN | disclosed |
| CN-114174411-A | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-03-11 | — | — | CN | disclosed |
| CN-113574102-A | Prepreg, metal foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2021-10-29 | — | — | CN | disclosed |
| CN-111620982-A | Thermosetting resin composition, and adhesive sheet, metal-clad laminate and printed wiring board produced using same | 南亚新材料科技股份有限公司 | 2020-09-04 | — | — | CN | disclosed |
| CN-1914239-B | Curable resin composition | NIPPON STEEL CHEMICAL CO | 2010-05-05 | — | — | CN | disclosed |
| CN-1914239-A | Curable resin composition | NIPPON STEEL CHEMICAL CO (JP) | 2007-02-14 | — | — | CN | disclosed |
| EP-1097915-B1 | PROCESS FOR PRODUCING BISPHENOL A | NIPPON STEEL CHEMICAL CO (JP) | 2003-10-08 | — | — | EP | disclosed |
| US-6329556-B1 | CONDENSATION OF PHENOL WITH ACETONE IN THE PRESENCE OF CATION EXCHANGE RESIN AS CATALYST TO FORM 2,2-BIS(4-HYDROXYPHEYL)PROPANE | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2001-12-11 | — | — | US | disclosed |
| EP-1097915-A1 | PROCESS FOR PRODUCING BISPHENOL A | Nippon Steel Chemical Co., Ltd. (JP) | 2001-05-09 | — | — | EP | disclosed |
| EP-0150908-B1 | Use of Curable impregnant compositions for impregnating electrical appliances | NIPPON PETROCHEMICALS CO LTD (JP) | 1998-04-15 | — | — | EP | disclosed |
| US-4670348-A | Electrical appliance impregnated with a curable impregnant composition | NIPPON PETROCHEMICALS CO., LTD. (JP) | 1987-06-02 | — | — | US | disclosed |
| EP-0150908-A1 | Use of Curable impregnant compositions for impregnating electrical appliances | NIPPON PETROCHEMICALS COMPANY, LIMITED (JP) | 1985-08-07 | — | — | EP | disclosed |