SCHEMBL710785

SCHEMBL710785

CC(O)CSCCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2218380 0.87 TDP1 (0.36)
SCHEMBL2058553 0.85 TSHR (0.39)
SCHEMBL16212597 0.84
SCHEMBL27936569 0.82 PRKD3 (0.38)
SCHEMBL2214760 0.82 ROCK2 (0.36)
SCHEMBL8671778 0.80 PRKD3 (0.34)
Thiodiglycol SCHEMBL11578815 0.80 TDP1 (0.59)
SCHEMBL1148911 0.80
SCHEMBL13965469 0.80 TDP1 (0.50)
SCHEMBL9013594 0.79 TDP1 (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 190 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116731286-B Modified hydrogenated bisphenol type epoxy resin and preparation method and application thereof 宁德时代新能源科技股份有限公司 2024-01-19 CN claimed
CN-116731286-A Modified hydrogenated bisphenol type epoxy resin and preparation method and application thereof 宁德时代新能源科技股份有限公司 2023-09-12 CN claimed
CN-111808566-B Epoxy resin adhesive for electronic device and preparation method thereof 郯城博化化工科技有限公司 2022-05-31 CN claimed
CN-111808566-A Epoxy resin adhesive for electronic device and preparation method thereof 郯城博化化工科技有限公司 2020-10-23 CN claimed
CN-103304773-B Ionic solidifying agent and preparation method thereof HAOLISEN COATING (SHANGHAI) CO., LTD. (CN) 2016-01-20 CN claimed
CN-103304773-A Ionic curing agent and preparation method thereof HLS COATING SHANGHAI CO LTD 2013-09-18 CN claimed
CN-101538430-B Inkjet ink, inkjet recording method, ink cartridge, recording unit, and inkjet recording apparatus CANON KK 2013-06-05 CN claimed
US-7094324-B2 Electrodeposition coating method using lead-free cationic electrodeposition coating composition NIPPON PAINT CO., LTD. (JP) 2006-08-22 US claimed
US-20040026248-A1 Electrodeposition coating method using lead-free cationic electrodeposition coating composition NIPPON PAINT CO., LTD. (JP) 2004-02-12 US claimed
US-5612395-A Pigment grinding resin composition for electrodeposition paint and pigment paste containing the same NIPPON PAINT CO., LTD. (JP) 1997-03-18 US claimed
US-12480005-B2 Method for preparing cationic electrodeposition coating composition NIPPON PAINT AUTOMOTIVE COATINGS CO., LTD. (JP) 2025-11-25 US disclosed
EP-4628554-A1 AQUEOUS INKJET INK Sakata INX Corp. (JP) 2025-10-08 EP disclosed
CN-118019815-A Electrodeposition coating composition, electrodeposition coating method, and laminate 日涂工业涂料有限公司 2024-05-10 CN disclosed
CN-116731286-B Modified hydrogenated bisphenol type epoxy resin and preparation method and application thereof 宁德时代新能源科技股份有限公司 2024-01-19 CN disclosed
CN-116731286-A Modified hydrogenated bisphenol type epoxy resin and preparation method and application thereof 宁德时代新能源科技股份有限公司 2023-09-12 CN disclosed
EP-0668308-A1 A curing agent and a cationic electrodeposition coating composition containing the same Nippon Paint Co., Ltd. (JP) 1995-08-23 EP disclosed
EP-0668307-A1 A curing agent and a cationic electrodeposition coating composition containing the same Nippon Paint Co., Ltd. (JP) 1995-08-23 EP disclosed
EP-0662500-A2 Sulfonium group-containing pigment grinding resin and pigment paste for electrodeposition paint Nippon Paint Co., Ltd. (JP) 1995-07-12 EP disclosed
EP-0625530-A1 Oxazolidone ring-containing modified epoxy resins and cathodic electrodeposition paints containing same Nippon Paint Co., Ltd. (JP) 1994-11-23 EP disclosed
WO-1982001880-A1 LIQUID POLYTHIOETHERS PRODUCTS RES & CHEM CORP (US) 1982-06-10 WO disclosed