Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 2/20 | 0.39 |
| ▸ | TLR2 | O60603 | 3/20 | 0.37 |
| ▸ | TLR8 | Q9NR97 | 6/20 | 0.37 |
| ▸ | LMNA | P02545 | 3/20 | 0.36 |
| ▸ | NPC1 | O15118 | 2/20 | 0.36 |
| ▸ | RAB9A | P51151 | 2/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.35 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.34 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.34 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.34 |
| ▸ | HTR2B | P41595 | 1/20 | 0.34 |
| ▸ | SLC6A3 | Q01959 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4738095 | 0.90 | TLR8 (0.33) | LTA4HTLR2TLR8LMNAMEN1 | |
| SCHEMBL11033252 | 0.89 | TLR8 (0.38) | LTA4HTLR2TLR8TSHRALDH1A1 | |
| SCHEMBL19809308 | 0.87 | LTA4H (0.43) | LTA4HTLR8LMNANPC1RAB9A | |
| SCHEMBL707497 | 0.85 | LTA4H (0.43) | LTA4HTLR8LMNANPC1RAB9A | |
| SCHEMBL702248 | 0.85 | LTA4H (0.43) | LTA4HTLR8LMNANPC1RAB9A | |
| SCHEMBL710735 | 0.85 | LTA4H (0.43) | LTA4HTLR8LMNANPC1RAB9A | |
| SCHEMBL28867246 | 0.84 | LTA4H (0.39) | LTA4HLMNANPC1RAB9ASMN1; SMN2 | |
| SCHEMBL20483784 | 0.83 | LTA4H (0.40) | LTA4HLMNANPC1RAB9ASMN1; SMN2 | |
| SCHEMBL1069349 | 0.83 | MAOA (0.34) | TLR8 | |
| SCHEMBL706144 | 0.83 | LTA4H (0.44) | LTA4HTLR8LMNANPC1RAB9A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0330456-B1 | Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom | CHISSO CORP (JP) | 1994-09-07 | — | — | EP | claimed |
| US-6664021-B1 | Acid generator and silicon-containing polyimide ester precursor comprising partially esterified silicon-containing polyamic ester; radiating with light | CHISSO CORPORATION (JP) | 2003-12-16 | — | — | US | disclosed |
| EP-0601203-B1 | PHOTOSENSITIVE RESIN COMPOSITION | CHISSO CORP (JP) | 1999-09-29 | — | — | EP | disclosed |
| EP-0546814-B1 | A polyimide photosensitive cover coating agent | CHISSO CORP (JP) | 1997-09-17 | — | — | EP | disclosed |
| EP-0456469-B1 | Photosensitive heat-resistant polymer having hydroxyphenyl group | CHISSO CORP (JP) | 1996-08-21 | — | — | EP | disclosed |
| US-5473040-A | A protective coatings comprising a crosslinked terpolymer of polyimide, polysilsesquioxane and polysiloxane; hardness, heat resistance, insulation | CHISSO CORPORATION (JP) | 1995-12-05 | — | — | US | disclosed |
| US-5449705-A | Silicon-containing polyamic acid derivative and photosensitive resin composition using it | CHISSO CORPORATION (JP) | 1995-09-12 | — | — | US | disclosed |
| US-5449588-A | Shrinkage inhibition | CHISSO CORPORATION (JP) | 1995-09-12 | — | — | US | disclosed |
| US-5442024-A | Polyamic acid having a crosslinkable silane group or copolymerized with a polysiloxane and a compound generating an acid catalyst to effect imidation upon radiating; films; photoresists; shrinkage inhibition; resolution; adhesion | CHISSO CORPORATION (JP) | 1995-08-15 | — | — | US | disclosed |
| EP-0379377-B1 | Process for preparing photosensitive heat-resistant polymer | CHISSO CORP (JP) | 1995-05-17 | — | — | EP | disclosed |
| US-5055549-A | Using isoimide intermediate | CHISSO CORPORATION (JP) | 1991-10-08 | — | — | US | disclosed |
| US-5026788-A | Photosensitive polymer having thiol group | CHISSO CORPORATION (JP) | 1991-06-25 | — | — | US | disclosed |
| US-5025088-A | Photosensitive poly(amide)imide heat-resistant polymer | CHISSO CORPORATION (JP) | 1991-06-18 | — | — | US | disclosed |
| US-4963635-A | REACTING A FLUORINE-CONTAINING DIANHYDRIDE OR DIANHYDRIDE, A FLUORINE-CONTAINING DIAMINE OR A DEIAMINE AND AN AMINO-CONTAINING OXYSILANE COMPOUND | CHISSO CORPORATION (JP) | 1990-10-16 | — | — | US | disclosed |
| EP-0379377-A2 | Process for preparing photosensitive heat-resistant polymer | Chisso Corporation (JP) | 1990-07-25 | — | — | EP | disclosed |
| EP-0348092-A2 | Photosensitive polymer having thiol groups | Chisso Corporation (JP) | 1989-12-27 | — | — | EP | disclosed |
| EP-0337698-A2 | Photosensitive Polymer | Chisso Corporation (JP) | 1989-10-18 | — | — | EP | disclosed |
| EP-0330456-A1 | Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom | CHISSO CORPORATION (JP) | 1989-08-30 | — | — | EP | disclosed |
| US-3950308-A | POLYAMIDES, POLYIMIDES, POLYAMIDE-IMIDES | CIBA-GEIGY CORPORATION (US) | 1976-04-13 | — | — | US | disclosed |
| US-3948835-A | POLYAMIDE, POLYAMIDE-ACID OR POLYAMIDE-AMIDE-ACIDS | CIBA-GEIGY CORPORATION (US) | 1976-04-06 | — | — | US | disclosed |