SCHEMBL716180

SCHEMBL716180

Nc1cc(-c2cc(N)cc(C(F)(F)F)c2)cc(C(F)(F)F)c1

nearest known ligand 0.50

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.50
MAPK1 P28482 1/20 0.50
KIF11 P52732 2/20 0.46
RXRA P19793 3/20 0.41
RXRB P28702 3/20 0.41
RXRG P48443 2/20 0.41
NR2E1 Q9Y466 1/20 0.41
IKBKB O14920 1/20 0.40
PTPN5 P54829 2/20 0.38
IDO1 P14902 2/20 0.37
ALDH1A1 P00352 2/20 0.37
MAPT P10636 1/20 0.37
NOS3 P29474 1/20 0.37
NOS2 P35228 1/20 0.37
CES2 O00748 1/20 0.36
KDM1A O60341 1/20 0.35
GLA P06280 1/20 0.34
POLB P06746 1/20 0.34
GAA P10253 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29576147 1.00 TSHR (0.50) TSHRMAPK1KIF11RXRARXRB
SCHEMBL9315932 0.97 TSHR (0.48) TSHRMAPK1KIF11RXRARXRB
SCHEMBL23045013 0.92 KIF11 (0.44) TSHRMAPK1KIF11RXRARXRB
SCHEMBL30600349 0.92 KIF11 (0.44) TSHRMAPK1KIF11RXRARXRB
SCHEMBL3785139 0.89 KIF11 (0.65) TSHRMAPK1KIF11RXRARXRB
SCHEMBL8741826 0.87 TSHR (0.55) TSHRMAPK1KIF11RXRARXRB
SCHEMBL3783746 0.87 KIF11 (0.54) TSHRMAPK1KIF11RXRARXRB
SCHEMBL30087058 0.87 KIF11 (0.54) TSHRMAPK1KIF11RXRARXRB
SCHEMBL130383 0.86 TSHR (0.56) TSHRMAPK1KIF11NR2E1IKBKB
SCHEMBL394717 0.86 TSHR (0.56) TSHRMAPK1KIF11NR2E1PTPN5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 100 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220177650-A1 POLYIMIDE FILM PREPARATION METHOD AND APPLICATION THEREOF INSTITUTE OF CHEMISTRY CHINESE ACADEMY OF SCIENCES (CN) 2022-06-09 US claimed
WO-2020200229-A1 POLYIMIDE THIN FILM AND PREPARATION METHOD AND APPLICATION THEREOF 中国科学院化学研究所 2020-10-08 WO claimed
EP-1382644-B1 Photosensitive polyimide resin precursor composition, optical waveguide using the polyimide and process for producing the optical waveguide NITTO DENKO CORP (JP) 2007-09-12 EP claimed
US-7037637-B2 Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide NITTO DENKO CORPORATION (JP) 2006-05-02 US claimed
US-20040013953-A1 Photosensitive polyimide resin precursor composition, optical polyimide obtained from the composition, optical waveguide using the polyimide, and process for producing the optical waveguide NITTO DENKO CORPORATION 2004-01-22 US claimed
EP-1382644-A1 Photosensitive polyimide resin precursor composition, optical waveguide using the polyimide and process for producing the optical waveguide NITTO DENKO CORPORATION (JP) 2004-01-21 EP claimed
US-12415892-B2 Polyimide film preparation method and application thereof INSTITUTE OF CHEMISTRY CHINESE ACADEMY OF SCIENCES (CN) 2025-09-16 US disclosed
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN disclosed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN disclosed
WO-2023195206-A1 POLYIMIDE PRECURSOR COMPOSITION AND POLYIMIDE JFEケミカル株式会社 2023-10-12 WO disclosed
US-20220177650-A1 POLYIMIDE FILM PREPARATION METHOD AND APPLICATION THEREOF INSTITUTE OF CHEMISTRY CHINESE ACADEMY OF SCIENCES (CN) 2022-06-09 US disclosed
WO-2020200229-A1 POLYIMIDE THIN FILM AND PREPARATION METHOD AND APPLICATION THEREOF 中国科学院化学研究所 2020-10-08 WO disclosed
US-10704008-B2 Heat-conductive silicone grease composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-07-07 US disclosed
US-6001517-A A THERMOSETTING POLYMER WHICH CAN BE CURED THROUGH CYCLODEHYDRATION UPON HEATING AND A CURE ACCELERATOR WHICH CAN BE DEACTIVATED OF ITS CURE ACCELERATION PROPERTY BY IRRIDIATION OF LIGHT KABUSHIKI KAISHA TOSHIBA (JP) 1999-12-14 US disclosed
US-5840369-A SCREEN PRINTING POLYIMIDE PRECURSOR INK ON SUBSTRATE, REMOVING SOLVENT, THERMALLY CURING INK TO FORM POLYIMIDE RELIEF PATTERN FILM CENTRAL GLASS CO., LTD. (JP) 1998-11-24 US disclosed
US-5756650-A COMPOSITION COMPRISING POLYAMIC ACID, CURE ACCELERATOR SELECTED FROM GROUP CONSISTING OF NITROGEN-CONTAINING HETEROCYCLIC COMPOUND, AMINO ACID COMPOUND, AROMATIC COMPOUND HAVING TWO OR MORE HYDROXYL GROUPS KABUSHIKI KAISHA TOSHIBA (JP) 1998-05-26 US disclosed
US-5686525-A THIXOTROPIC SCREEN PRINTING INK COMPRISING A HEAT TREATED POLYAMIC ACID SOLUTION OBTAINED BY REACTION OF AROMATIC TETRACARBOXYLIC ACID, DIAMINE AND A MALEIMIDE; RELIEF IMAGES CENTRAL GLASS COMPANY, LTD. (JP) 1997-11-11 US disclosed
US-5578697-A DIELECTRIC POLYMERS FOR ELECTRONICS KABUSHIKI KAISHA TOSHIBA (JP) 1996-11-26 US disclosed
EP-0659800-A1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition CENTRAL GLASS COMPANY, LIMITED (JP) 1995-06-28 EP disclosed
WO-1995004305-A1 PHOTOSENSITIVE FLUORINATED POLY(AMIC ACID) AMINOACRYLATE SALT E.I. DU PONT DE NEMOURS AND COMPANY (US) 1995-02-09 WO disclosed