Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.45 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6287842 | 0.86 | TSHR (0.45) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL8002490 | 0.78 | TSHR (0.45) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL329825 | 0.73 | TSHR (0.45) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL3817963 | 0.71 | TSHR (0.46) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL28534449 | 0.71 | TSHR (0.46) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL4982471 | 0.69 | TSHR (0.55) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL8002486 | 0.69 | TSHR (0.46) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL9760116 | 0.68 | TSHR (0.45) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL10071424 | 0.67 | TSHR (0.74) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL2623200 | 0.67 | TSHR (0.82) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6548175-B2 | For solder-free interconnections in microelectronic assembly procedures for attachment of electronic components to substrate; for chip carrier-to-substrate interconnections; low tensile modulus, low resistivity, high adhesion strength | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2003-04-15 | — | — | US | disclosed |
| US-20020127406-A1 | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-09-12 | — | — | US | disclosed |