Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.59 |
| ▸ | TSHR | P16473 | 6/20 | 0.59 |
| ▸ | LMNA | P02545 | 4/20 | 0.59 |
| ▸ | MAPK1 | P28482 | 4/20 | 0.57 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.57 |
| ▸ | TP53 | P04637 | 1/20 | 0.57 |
| ▸ | KDM4E | B2RXH2 | 5/20 | 0.53 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.53 |
| ▸ | POLB | P06746 | 1/20 | 0.53 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.51 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.51 |
| ▸ | MMP2 | P08253 | 1/20 | 0.50 |
| ▸ | MMP1 | P03956 | 1/20 | 0.49 |
| ▸ | MMP9 | P14780 | 1/20 | 0.49 |
| ▸ | MMP12 | P39900 | 1/20 | 0.49 |
| ▸ | KDM4A | O75164 | 1/20 | 0.47 |
| ▸ | KDM4C | Q9H3R0 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.44 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9601334 | 1.00 | ALDH1A1 (0.59) | ALDH1A1TSHRLMNAMAPK1CYP3A4 | |
| SCHEMBL27972796 | 1.00 | ALDH1A1 (0.59) | ALDH1A1TSHRLMNAMAPK1CYP3A4 | |
| SCHEMBL716141 | 0.95 | TSHR (0.57) | ALDH1A1TSHRLMNAMAPK1CYP3A4 | |
| SCHEMBL6395560 | 0.84 | TSHR (0.53) | ALDH1A1TSHRLMNACYP3A4KDM4E | |
| SCHEMBL2369098 | 0.82 | TSHR (0.50) | ALDH1A1TSHRLMNAMAPK1CYP3A4 | |
| SCHEMBL28472895 | 0.81 | HTT (0.46) | ALDH1A1MAPT | |
| SCHEMBL8780374 | 0.80 | PLA2G4B (0.46) | TSHRTP53 | |
| SCHEMBL5983495 | 0.80 | ALDH1A1 (0.59) | ALDH1A1TSHRLMNAMAPK1CYP3A4 | |
| Heptane SCHEMBL28770979 | 0.78 | ALDH1A1 (0.96) | ALDH1A1TSHRLMNAMAPK1CYP3A4 | |
| SCHEMBL81945 | 0.76 | ALDH1A1 (1.00) | ALDH1A1TSHRLMNAMAPK1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 99 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109743878-B | Suspension and grinding method | 昭和电工材料株式会社 | 2021-07-06 | — | — | CN | claimed |
| CN-107406752-B | Polishing agent, stock solution for polishing agent, and polishing method | 日立化成株式会社 | 2020-05-08 | — | — | CN | claimed |
| US-20070128872-A1 | Polishing composition and polishing method | SHOWA DENKO K.K. (JP) | 2007-06-07 | — | — | US | claimed |
| EP-1687387-A1 | POLISHING COMPOSITION COMPRISING PHOSPHATE ESTERS AND POLISHING METHOD | Showa Denko K.K. (JP) | 2006-08-09 | — | — | EP | claimed |
| WO-2005047409-A1 | POLISHING COMPOSITION AND POLISHING METHOD | SHOWA DENKO K.K. (JP) | 2005-05-26 | — | — | WO | claimed |
| US-4187186-A | WEAR, OXIDATION AND CORROSION RESISTANT | MOBIL OIL CORPORATION (US) | 1980-02-05 | — | — | US | claimed |
| EP-4379780-A1 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-06-05 | — | — | EP | disclosed |
| EP-4379779-A1 | POLISHING SOLUTION, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-06-05 | — | — | EP | disclosed |
| EP-4339254-A1 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-03-20 | — | — | EP | disclosed |
| CN-117693806-A | Polishing liquid, polishing method, method for manufacturing component, and method for manufacturing semiconductor component | 株式会社力森诺科 | 2024-03-12 | — | — | CN | disclosed |
| CN-117693807-A | Polishing liquid, polishing method, method for manufacturing component, and method for manufacturing semiconductor component | 株式会社力森诺科 | 2024-03-12 | — | — | CN | disclosed |
| CN-117480589-A | Polishing liquid, polishing method, method for manufacturing component, and method for manufacturing semiconductor component | 株式会社力森诺科 | 2024-01-30 | — | — | CN | disclosed |
| WO-2023032928-A1 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | 株式会社レゾナック | 2023-03-09 | — | — | WO | disclosed |
| WO-2004039905-A1 | COMPOSITION FOR POLISHING METAL, POLISHING METHOD FOR METAL LAYER, AND PRODUCTION METHOD FOR WAFER | SHOWA DENKO K.K. (JP) | 2004-05-13 | — | — | WO | disclosed |
| WO-2003104350-A1 | METAL POLISH COMPOSITION, POLISHING METHOD USING THE COMPOSITION AND METHOD FOR PRODUCING WAFER USING THE POLISHING METHOD | SHOWA DENKO K.K. (JP) | 2003-12-18 | — | — | WO | disclosed |
| US-20030219982-A1 | CMP (chemical mechanical polishing) polishing liquid for metal and polishing method | HITACHI CHEMICAL CO., LTD (JP) | 2003-11-27 | — | — | US | disclosed |
| US-20020017630-A1 | Abrasive liquid for metal and method for polishing | RENESAS ELECTRONICS CORPORATION (JP) | 2002-02-14 | — | — | US | disclosed |
| EP-1150341-A1 | MATERIALS FOR POLISHING LIQUID FOR METAL, POLISHING LIQUID FOR METAL, METHOD FOR PREPARATION THEREOF AND POLISHING METHOD USING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-1137056-A1 | ABRASIVE LIQUID FOR METAL AND METHOD FOR POLISHING | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-09-26 | — | — | EP | disclosed |
| US-4187186-A | WEAR, OXIDATION AND CORROSION RESISTANT | MOBIL OIL CORPORATION (US) | 1980-02-05 | — | — | US | disclosed |