Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PKN1 | Q16512 | 1/20 | 0.50 |
| ▸ | PKN2 | Q16513 | 1/20 | 0.50 |
| ▸ | RIPK1 | Q13546 | 2/20 | 0.47 |
| ▸ | MAPT | P10636 | 2/20 | 0.46 |
| ▸ | NR4A2 | P43354 | 2/20 | 0.44 |
| ▸ | CREBBP | Q92793 | 1/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.43 |
| ▸ | ATM | Q13315 | 2/20 | 0.43 |
| ▸ | GAA | P10253 | 2/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 2/20 | 0.43 |
| ▸ | TSHR | P16473 | 2/20 | 0.43 |
| ▸ | STAT3 | P40763 | 1/20 | 0.43 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.42 |
| ▸ | CFTR | P13569 | 1/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.42 |
| ▸ | ALOX5 | P09917 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.41 |
| ▸ | GLA | P06280 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27424880 | 0.85 | PARP1 (0.38) | PKN1PKN2RIPK1 | |
| SCHEMBL28405125 | 0.84 | PKN1 (0.35) | PKN1PKN2RIPK1MAPTKDM4E | |
| SCHEMBL6395560 | 0.83 | TSHR (0.53) | MAPTKDM4EATMGAAKMT2A | |
| SCHEMBL2418352 | 0.83 | GABRP (0.39) | PKN1PKN2RIPK1LMNAALDH1A1 | |
| SCHEMBL8853708 | 0.81 | PBRM1 (0.40) | KDM4E | |
| SCHEMBL2188295 | 0.81 | PARP1 (0.39) | PKN1PKN2KDM4E | |
| SCHEMBL11086452 | 0.81 | PKN1 (0.34) | PKN1PKN2RIPK1MAPTKDM4E | |
| SCHEMBL3838769 | 0.80 | ALDH1A1 (0.54) | MAPTNR4A2KDM4EKMT2ALMNA | |
| SCHEMBL29453826 | 0.80 | KDM4E (0.47) | KDM4EALDH1A1 | |
| SCHEMBL4813379 | 0.80 | PARP1 (0.38) | PKN1PKN2KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 153 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109743878-B | Suspension and grinding method | 昭和电工材料株式会社 | 2021-07-06 | — | — | CN | claimed |
| CN-107406752-B | Polishing agent, stock solution for polishing agent, and polishing method | 日立化成株式会社 | 2020-05-08 | — | — | CN | claimed |
| US-20090130849-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. | 2009-05-21 | — | — | US | claimed |
| WO-2009058274-A1 | CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE | EKC TECHNOLOGY, INC. (US) | 2009-05-07 | — | — | WO | claimed |
| US-20070128872-A1 | Polishing composition and polishing method | SHOWA DENKO K.K. (JP) | 2007-06-07 | — | — | US | claimed |
| CN-1902291-A | Polishing composition and polishing method | SHOWA DENKO KK (JP) | 2007-01-24 | — | — | CN | claimed |
| EP-1687387-A1 | POLISHING COMPOSITION COMPRISING PHOSPHATE ESTERS AND POLISHING METHOD | Showa Denko K.K. (JP) | 2006-08-09 | — | — | EP | claimed |
| WO-2005047409-A1 | POLISHING COMPOSITION AND POLISHING METHOD | SHOWA DENKO K.K. (JP) | 2005-05-26 | — | — | WO | claimed |
| US-20250197783-A1 | PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2025-06-19 | — | — | US | disclosed |
| EP-4379780-A1 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-06-05 | — | — | EP | disclosed |
| EP-4379779-A1 | POLISHING SOLUTION, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-06-05 | — | — | EP | disclosed |
| CN-115232144-B | Nitrogen-containing condensed ring derivative, pharmaceutical composition, and preparation method and application thereof | 长春金赛药业有限责任公司 | 2024-04-02 | — | — | CN | disclosed |
| EP-4339254-A1 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | Resonac Corporation (JP) | 2024-03-20 | — | — | EP | disclosed |
| CN-117693807-A | Polishing liquid, polishing method, method for manufacturing component, and method for manufacturing semiconductor component | 株式会社力森诺科 | 2024-03-12 | — | — | CN | disclosed |
| CN-1392215-A | Metal polishing liquid material, metal polishing liquid, method for producing same, and polishing method using same | HITACHI CHEMICAL CO LTD (JP) | 2003-01-22 | — | — | CN | disclosed |
| EP-1150341-A1 | MATERIALS FOR POLISHING LIQUID FOR METAL, POLISHING LIQUID FOR METAL, METHOD FOR PREPARATION THEREOF AND POLISHING METHOD USING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-1137056-A1 | ABRASIVE LIQUID FOR METAL AND METHOD FOR POLISHING | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-09-26 | — | — | EP | disclosed |
| US-5032498-A | Soluble stabilizers | CIBA-GEIGY CORPORATION (US) | 1991-07-16 | — | — | US | disclosed |
| US-4973702-A | AMIDES AND ESTERS, UV STABILIZERS FOR PLASTICS AND PHOTOGRAPHIC MATERIALS | CIBA-GEIGY CORPORATION (US) | 1990-11-27 | — | — | US | disclosed |
| US-4853471-A | 2-(2-Hydroxyphenyl)-benztriazoles, their use as UV-absorbers and their preparation | CIBA-GEIGY CORPORATION (US) | 1989-08-01 | — | — | US | disclosed |