Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.62 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.53 |
| ▸ | GAA | P10253 | 2/20 | 0.53 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.53 |
| ▸ | POLB | P06746 | 3/20 | 0.50 |
| ▸ | EP300 | Q09472 | 1/20 | 0.48 |
| ▸ | KAT2B | Q92831 | 1/20 | 0.48 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.48 |
| ▸ | MGLL | Q99685 | 1/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | MEN1 | O00255 | 4/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.44 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | NPC1 | O15118 | 1/20 | 0.44 |
| ▸ | S1PR4 | O95977 | 1/20 | 0.44 |
| ▸ | XBP1 | P17861 | 1/20 | 0.44 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.44 |
| ▸ | CCR6 | P51684 | 1/20 | 0.44 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.44 |
| ▸ | BCHE | P06276 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29760726 | 0.98 | SMN1; SMN2 (0.60) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL7479419 | 0.78 | ALDH1A1 (0.73) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL30817653 | 0.78 | ALDH1A1 (0.73) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL30817652 | 0.78 | ALDH1A1 (0.73) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL10999884 | 0.77 | SMN1; SMN2 (1.00) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL9788869 | 0.77 | SMN1; SMN2 (0.60) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL28009909 | 0.75 | SMN1; SMN2 (0.48) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL14357435 | 0.75 | KDM4E (0.74) | SMN1; SMN2KDM4EGAAALDH1A1POLB | |
| SCHEMBL349418 | 0.75 | MGLL (0.50) | ALDH1A1TLR9MGLLBCHEHTT | |
| SCHEMBL30566302 | 0.74 | SMN1; SMN2 (0.61) | SMN1; SMN2KDM4EGAAALDH1A1POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119431678-A | Flame retardant composition | 长春人造树脂厂股份有限公司 | 2025-02-14 | — | — | CN | claimed |
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| CN-120025660-A | Resin composition and use thereof | 台燿科技股份有限公司 | 2025-05-23 | — | — | CN | disclosed |
| CN-119431678-A | Flame retardant composition | 长春人造树脂厂股份有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-118786161-A | Copolymers derived from dicyclopentadiene | 高新特殊工程塑料全球技术有限公司 | 2024-10-15 | — | — | CN | disclosed |
| CN-115038736-B | Functionalized poly (arylene ether) copolymers, methods of making, and articles derived therefrom | 高新特殊工程塑料全球技术有限公司 | 2024-06-04 | — | — | CN | disclosed |
| CN-115335431-B | Modified poly (phenylene ether) copolymers, compositions and methods | 高新特殊工程塑料全球技术有限公司 | 2024-05-24 | — | — | CN | disclosed |
| CN-111004385-B | Poly (arylene ether) copolymer | 高新特殊工程塑料全球技术有限公司 | 2024-04-12 | — | — | CN | disclosed |
| CN-117659387-A | Poly (arylene ether) copolymer | 高新特殊工程塑料全球技术有限公司 | 2024-03-08 | — | — | CN | disclosed |
| CN-113667232-B | Resin composition, prepreg, metal foil laminate and printed wiring board each produced using the same | 台燿科技股份有限公司 | 2023-09-01 | — | — | CN | disclosed |
| EP-0269021-A1 | Resin composition for printed circuit board and such board formed by use thereof | HITACHI, LTD. (JP) | 1988-06-01 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0078039-B1 | THERMOSETTING RESIN COMPOSITION, PREPOLYMER THEREOF AND CURED ARTICLE THEREOF | Hitachi, Ltd. (JP) | 1986-01-22 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| US-4400438-A | MALEIMIDE RESING AND HALOGENATED DIPHENYL ETHER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1983-08-23 | — | — | US | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |