SCHEMBL7187432

SCHEMBL7187432

CC1COC(=O)c2ccc3c(c2CC3C)C(=O)O1

nearest known ligand 0.40

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
MAOA P21397 12/20 0.40
MAOB P27338 9/20 0.39
TOP2A P11388 2/20 0.38
POLL Q9UGP5 1/20 0.36
ACHE P22303 2/20 0.36
KDM4E B2RXH2 1/20 0.35
POLB P06746 1/20 0.35
MAPT P10636 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7192840 0.89 MAOA (0.40) MAOAMAOBTOP2APOLLACHE
SCHEMBL16470222 0.72 MAOA (0.39) MAOAMAOBPOLLKDM4EPOLB
SCHEMBL8468103 0.71 PTPRF (0.36) MAOAMAOB
SCHEMBL9722584 0.71 MAOA (0.41) MAOAMAOBACHEPOLB
SCHEMBL29795053 0.71 MAOA (0.41) MAOAMAOBACHEPOLB
SCHEMBL5177685 0.70 MAOA (0.39) MAOAMAOBACHEKDM4EPOLB
SCHEMBL493904 0.66
Propylene Carbonate SCHEMBL29276507 0.66 MAOA (0.36) MAOAMAOBACHE
SCHEMBL4788432 0.66 ACHE (0.41) MAOAMAOBTOP2AACHEKDM4E
SCHEMBL66015 0.66 MAOA (0.37) MAOAMAOBPOLLKDM4EPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0807644-B1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2003-02-12 EP claimed
US-5969009-A COATING IRON CORE WITH A MOLDING MATERIAL CONTAINING A THERMOSETTING RESIN BINDER WITH AN UNSATURATED POLYESTER, AN ADDITION-POLYMERIZABLE MONOMER HAVING AN AFFINITY FOR ALKALINE SOLUTION, ALSO A LOW SHRINKAGE AGENT MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) 1999-10-19 US claimed
EP-0807644-A1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1997-11-19 EP claimed
US-20130264896-A1 MOLDED STRUCTURAL BODY AND MOTOR HAVING SAME PANASONIC CORPORATION (JP) 2013-10-10 US disclosed
EP-0807644-B1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2003-02-12 EP disclosed
US-6332998-B1 MOLDINGS AND COVERING WITH HEAT CURING COMPOSITION FOR ELECTRONICS MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2001-12-25 US disclosed
US-5969009-A COATING IRON CORE WITH A MOLDING MATERIAL CONTAINING A THERMOSETTING RESIN BINDER WITH AN UNSATURATED POLYESTER, AN ADDITION-POLYMERIZABLE MONOMER HAVING AN AFFINITY FOR ALKALINE SOLUTION, ALSO A LOW SHRINKAGE AGENT MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. (JP) 1999-10-19 US disclosed
EP-0807644-A1 MOLDING MATERIAL AND MOLDED MOTOR MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1997-11-19 EP disclosed