SCHEMBL7196427

SCHEMBL7196427

C=C[Si](C=C)(C=C)O[SiH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL335955 0.67
SCHEMBL335991 0.61
SCHEMBL13621333 0.61
SCHEMBL3010609 0.61
SCHEMBL13621350 0.59
SCHEMBL17865423 0.59
SCHEMBL3481575 0.57
SCHEMBL13621297 0.57
SCHEMBL3481321 0.57
SCHEMBL9617188 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1006145-B1 Addition-curable silicone rubber composition SHINETSU CHEMICAL CO (JP) 2003-02-26 EP disclosed
US-20020016019-A1 PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE PACKAGE AND ORGANOPOLYSILOXANE COMPOSITION USED THEREFOR IKENO MASAYUKI (JP) 2002-02-07 US disclosed
US-6274658-B1 ACRYLATED RESIN; USING PLATINUM CATALYST; STORAGE STABILITY; FAST CURING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-08-14 US disclosed
EP-1006145-A1 Addition-curable silicone rubber composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-06-07 EP disclosed
EP-0939440-A2 Process for producing semiconductor device package and organopolysiloxane composition used therefor SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-09-01 EP disclosed
US-4654408-A POLYSILOXANES END CAPPED WITH VINYL GROUPS SHIN-ETSU CHEMICAL CO., LTD. (JP) 1987-03-31 US disclosed