SCHEMBL7201127

SCHEMBL7201127

Oc1cccc(-n2cnc(-c3ccccc3)c2-c2ccccc2)c1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FGFR1 P11362 3/20 0.57
FAAH O00519 4/20 0.57
OPRD1 P41143 4/20 0.52
OPRM1 P35372 2/20 0.51
MAPK13 O15264 2/20 0.46
MAPK12 P53778 2/20 0.46
MAPK11 Q15759 2/20 0.46
MAPK14 Q16539 2/20 0.46
ESR1 P03372 1/20 0.44
ESR2 Q92731 1/20 0.44
MEN1 O00255 1/20 0.44
GAA P10253 1/20 0.44
KMT2A Q03164 1/20 0.44
PTGS2 P35354 1/20 0.43
OPRK1 P41145 1/20 0.41
MITF O75030 1/20 0.41
ALDH1A1 P00352 1/20 0.41
LMNA P02545 1/20 0.41
HTT P42858 1/20 0.41
SMN1; SMN2 Q16637 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5720398 0.84 FAAH (0.56) FGFR1FAAHMAPK13MAPK12MAPK11
SCHEMBL27639359 0.83 FAAH (0.56) FGFR1FAAHMAPK13MAPK12MAPK11
SCHEMBL27546095 0.74 FAAH (0.47) FAAHMAPK13MAPK12MAPK11MAPK14
SCHEMBL2179670 0.74 ALDH1A1 (0.49) FGFR1FAAHMAPK13MAPK12MAPK11
SCHEMBL27595420 0.73 MAPK14 (0.59) FAAHMAPK13MAPK12MAPK11MAPK14
SCHEMBL29992805 0.73 FGFR1 (1.00) FGFR1ESR1ESR2HTT
SCHEMBL28111191 0.73 FAAH (0.53) FGFR1FAAHGAAPTGS2MITF
SCHEMBL7993245 0.73 FGFR1 (1.00) FGFR1ESR1ESR2HTT
SCHEMBL14124512 0.72 HTT (0.58) FGFR1FAAHPTGS2MITFALDH1A1
Hydrochloric Acid SCHEMBL7987670 0.72 FGFR1 (0.97) FGFR1ESR1ESR2HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2003044089-A1 THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS HENKEL CORPORATION (US) 2003-05-30 WO claimed
CN-106750186-A Composition epoxy resin 气体产品与化学公司 2017-05-31 CN disclosed