⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL366049 | 0.87 | HTR7 (0.50) | — | |
| Hydrochloric Acid SCHEMBL3379346 | 0.84 | HTR7 (0.48) | — | |
| SCHEMBL17540480 | 0.78 | HTR1A (0.39) | — | |
| SCHEMBL8814666 | 0.75 | HTR7 (0.46) | — | |
| SCHEMBL6420602 | 0.75 | HTR7 (0.46) | — | |
| SCHEMBL18210498 | 0.74 | TSHR (0.56) | — | |
| SCHEMBL18215308 | 0.74 | HTR1A (0.40) | — | |
| SCHEMBL12039646 | 0.73 | — | — | |
| SCHEMBL15337873 | 0.73 | — | — | |
| SCHEMBL2467193 | 0.70 | MEN1 (0.40) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6607653-B1 | Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with | DAIWA FINE CHEMICALS CO., LTD. (JP) | 2003-08-19 | — | — | US | disclosed |