SCHEMBL7213119

SCHEMBL7213119

CCCCCOC(F)CCCC

nearest known ligand 0.43

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.43
ALDH1A1 P00352 1/20 0.35
CNR1 P21554 1/20 0.35
CNR2 P34972 1/20 0.35
MAPT P10636 1/20 0.34
GBA1 P04062 1/20 0.34
LPAR1 Q92633 4/20 0.33
LPAR3 Q9UBY5 4/20 0.33
LPAR2 Q9HBW0 1/20 0.33
PLA2G2C Q5R387 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28636994 0.93 DNM1 (0.47) DNM1MAPTGBA1LPAR1LPAR3
SCHEMBL5031261 0.88 DNM1 (0.42) DNM1MAPT
SCHEMBL10819065 0.88 DNM1 (0.42) DNM1MAPT
SCHEMBL2648955 0.88 DNM1 (0.47) DNM1MAPTGBA1LPAR1LPAR3
SCHEMBL31296249 0.85 ADRB2 (0.38) DNM1ALDH1A1MAPT
SCHEMBL9284493 0.80 MAPT (0.35) DNM1CNR1CNR2MAPT
SCHEMBL2369842 0.79
SCHEMBL6134150 0.77 USP2 (0.47) DNM1ALDH1A1CNR1CNR2MAPT
SCHEMBL2370147 0.77 DNM1 (0.54) DNM1MAPTLPAR1LPAR3LPAR2
SCHEMBL29143221 0.77 DNM1 (0.54) DNM1MAPTLPAR1LPAR3LPAR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12027565-B2 Imaging device having charge storage electrode, first electrode, second electrode and transfer control electrode, driving method for imaging device having the same, and electronic apparatus Sony Group Corporation (JP) 2024-07-02 US disclosed
US-11903226-B2 Photoelectric conversion element and imaging device Sony Group Corporation (JP) 2024-02-13 US disclosed
US-20240029654-A1 DISPLAY DEVICE SONY GROUP CORP (JP) 2024-01-25 US disclosed
US-20230326953-A1 IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING DEVICE SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) 2023-10-12 US disclosed
US-11776475-B2 Display device Sony Group Corporation (JP) 2023-10-03 US disclosed
US-11699719-B2 Imaging element, stacked imaging element, and solid-state imaging device SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) 2023-07-11 US disclosed
CN-108369952-B Imaging device and electronic device 索尼公司 2023-07-07 CN disclosed
US-20230165020-A1 PHOTOELECTRIC CONVERSION ELEMENT AND IMAGING DEVICE SONY GROUP CORP (JP) 2023-05-25 US disclosed
US-11652122-B2 Imaging element, method of manufacturing imaging element, imaging device, and method of manufacturing imaging device SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) 2023-05-16 US disclosed
US-11581370-B2 Photoelectric conversion element and imaging device SONY CORPORATION (JP) 2023-02-14 US disclosed
CN-101388436-B Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board SONY CORP 2011-07-06 CN disclosed
CN-101326653-B Organic semiconductor device and organic semiconductor thin film SONY CORP 2010-06-09 CN disclosed
CN-100475544-C Pattern forming method, method for manufacturing organic field effect transistor, and method for manufacturing flexible printed circuit board SONY CORP (JP) 2009-04-08 CN disclosed
CN-101388436-A Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board SONY CORP (JP) 2009-03-18 CN disclosed
CN-101326653-A Organic semiconductor device and organic semiconductor thin film SONY CORP (JP) 2008-12-17 CN disclosed
CN-101246850-A Insulated gate field effect transistor and method for manufacturing the same SONY CORP (JP) 2008-08-20 CN disclosed
CN-1853943-A Pattern forming method, method for manufacturing organic field effect transistor, and method for manufacturing flexible printed circuit board SONY CORP (JP) 2006-11-01 CN disclosed
US-6624062-B2 Wiring structure in semiconductor device and method for forming the same SONY CORPORATION (JP) 2003-09-23 US disclosed
US-20020060362-A1 Wiring structure in semiconductor device and method for forming the same MIYAMOTO TAKAAKI (JP) 2002-05-23 US disclosed
US-6337515-B1 Wiring structure in semiconductor device and method for forming the same SONY CORPORATION (JP) 2002-01-08 US disclosed