Ether

Ether

SCHEMBL722471

C=CCOC(C)=O.CC(O)COC(C)COC(C)CO.CCOCC

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 2/20 0.38
USP2 O75604 2/20 0.34
CYP3A4 P08684 2/20 0.34
MAPT P10636 2/20 0.34
SMN1; SMN2 Q16637 2/20 0.34
LMNA P02545 1/20 0.34
RECQL P46063 1/20 0.34
ALDH1A1 P00352 2/20 0.32
TSHR P16473 2/20 0.32
HPGD P15428 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethyl Acetate SCHEMBL896035 0.86 TDP1 (0.44) TDP1MAPTLMNAALDH1A1TSHR
Propylene Glycol SCHEMBL243614 0.85 TDP1 (0.41) TDP1USP2CYP3A4MAPTSMN1; SMN2
Propylene Glycol SCHEMBL8605999 0.85 TDP1 (0.41) TDP1USP2CYP3A4MAPTSMN1; SMN2
Acetic Acid Isobutyl Ester SCHEMBL1822918 0.84 TDP1 (0.41) TDP1USP2CYP3A4MAPTSMN1; SMN2
Acetic Acid Propyl Ester SCHEMBL896810 0.83 TDP1 (0.51) TDP1USP2MAPTSMN1; SMN2LMNA
Ether SCHEMBL5072571 0.82 TDP1 (0.45) TDP1ALDH1A1TSHR
SCHEMBL8577366 0.81 TDP1 (0.36) TDP1USP2CYP3A4MAPTSMN1; SMN2
Acetic Acid Butyl Ester SCHEMBL2692488 0.81 ALDH1A1 (0.47) TDP1USP2MAPTLMNAALDH1A1
SCHEMBL437165 0.80 TDP1 (0.44) TDP1
Ether SCHEMBL55521 0.80 TDP1 (0.55) TDP1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1670628-B Resist composition DAICEL CHEM 2011-02-09 CN claimed
CN-1670628-A Resist composition DAICEL CHEM (JP) 2005-09-21 CN claimed
EP-2777049-B1 CONDUCTIVE PASTE AND ELECTRONIC DEVICE AND SOLAR CELL INCLUDING AN ELECTRODE FORMED USING THE CONDUCTIVE PASTE SAMSUNG ELECTRONICS CO LTD (KR) 2020-01-08 EP disclosed
EP-2680275-B1 Conductive paste and electronic device and solar cell SAMSUNG ELECTRONICS CO LTD (KR) 2019-03-27 EP disclosed
US-10074752-B2 Conductive paste and electronic device and solar cell SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-09-11 US disclosed
US-9947809-B2 Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-04-17 US disclosed
US-20180019350-A9 CONDUCTIVE PASTE AND ELECTRONIC DEVICE AND SOLAR CELL INCLUDING AN ELECTRODE FORMED USING THE CONDUCTIVE PASTE SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-01-18 US disclosed
US-9870840-B2 Metallic glass, conductive paste, and electronic device SAMSUNG ELECTRONICS CO., LTD. (KR) 2018-01-16 US disclosed
US-9615454-B2 Transparent conductor, method of manufacturing the same, and electronic device including the transparent conductor SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-04-04 US disclosed
US-9301417-B2 Sealing material, display device, and method of manufacturing the display device SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-03-29 US disclosed
US-9218898-B2 Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste SAMSUNG ELECTRONICS CO., LTD. (KR) 2015-12-22 US disclosed
US-20130104973-A1 CONDUCTIVE PASTE, AND ELECTRONIC DEVICE AND SOLAR CELL INCLUDING ELECTRODE FORMED USING THE CONDUCTIVE PASTE SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-05-02 US disclosed
US-20120240994-A1 CONDUCTIVE PASTE AND ELECTRONIC DEVICE, AND SOLAR CELL INCLUDING AN ELECTRODE FORMED USING THE CONDUCTIVE PASTE SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-09-27 US disclosed
US-20120180859-A1 Conductive Paste, And Electronic Device And Solar Cell Including An Electrode Formed Using The Same SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-07-19 US disclosed
US-20120048363-A1 CONDUCTIVE PASTE, AND ELECTRONIC DEVICE AND SOLAR CELL INCLUDING AN ELECTRODE FORMED USING THE CONDUCTIVE PASTE SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-03-01 US disclosed
CN-1670628-B Resist composition DAICEL CHEM 2011-02-09 CN disclosed
CN-1670628-B Resist composition DAICEL CHEM 2011-02-09 CN disclosed
JP-2005301210-A RESIST COMPOSITION DAICEL CHEM IND LTD 2005-10-27 JP disclosed
CN-1670628-A Resist composition DAICEL CHEM (JP) 2005-09-21 CN disclosed
CN-1670628-A Resist composition DAICEL CHEM (JP) 2005-09-21 CN disclosed