Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TBXAS1 | P24557 | 2/20 | 0.50 |
| ▸ | CETP | P11597 | 4/20 | 0.49 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.48 |
| ▸ | CYP4F2 | P78329 | 2/20 | 0.46 |
| ▸ | CYP4A11 | Q02928 | 2/20 | 0.46 |
| ▸ | PPARG | P37231 | 6/20 | 0.39 |
| ▸ | PPARD | Q03181 | 6/20 | 0.39 |
| ▸ | PPARA | Q07869 | 6/20 | 0.39 |
| ▸ | HDAC11 | Q96DB2 | 5/20 | 0.39 |
| ▸ | TSHR | P16473 | 4/20 | 0.39 |
| ▸ | GPR84 | Q9NQS5 | 4/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.39 |
| ▸ | TLR2 | O60603 | 2/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | FABP4 | P15090 | 2/20 | 0.39 |
| ▸ | PTPN1 | P18031 | 2/20 | 0.39 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.39 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | ESR1 | P03372 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27621914 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL14673472 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL5520991 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL5512477 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL1264712 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL887781 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL482363 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL8034730 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL887733 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 | |
| SCHEMBL14673719 | 1.00 | TBXAS1 (0.50) | TBXAS1CETPCYP2C19CYP4F2CYP4A11 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12564879-B2 | Copper paste for joining, method for manufacturing joined body, and joined body | RESONAC CORPORATION (JP) | 2026-03-03 | — | — | US | disclosed |
| US-20250387833-A1 | METHOD FOR MANUFACTURING CONDUCTIVE VIA-CONTAINING SUBSTRATE, CONDUCTIVE VIA-CONTAINING SUBSTRATE, AND METAL PASTE | RESONAC CORP (JP) | 2025-12-25 | — | — | US | disclosed |
| US-20250293091-A1 | METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRATE HAVING THROUGH-SILICON VIAS, AND COPPER PASTE FOR THROUGH-SILICON VIA FORMATION | RESONAC CORPORATION (JP) | 2025-09-18 | — | — | US | disclosed |
| EP-4618701-A1 | METHOD FOR MANUFACTURING GLASS SUBSTRATE HAVING CONDUCTIVE VIA, METAL PASTE FOR FORMING THROUGH-GLASS VIA, AND GLASS SUBSTRATE HAVING CONDUCTIVE VIA | Resonac Corporation (JP) | 2025-09-17 | — | — | EP | disclosed |
| US-12354914-B2 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | RESONAC CORPORATION (JP) | 2025-07-08 | — | — | US | disclosed |
| CN-112673715-B | Electronic component and method for manufacturing electronic component | 株式会社力森诺科 | 2025-03-07 | — | — | CN | disclosed |
| WO-2024190405-A1 | METHOD FOR MANUFACTURING ELECTROCONDUCTIVE-VIA-EQUIPPED SUBSTRATE, ELECTROCONDUCTIVE-VIA-EQUIPPED SUBSTRATE, AND METAL PASTE | 株式会社レゾナック | 2024-09-19 | — | — | WO | disclosed |
| WO-2024190406-A1 | METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE VIA, AND METHOD FOR MANUFACTURING WIRING SUBSTRATE WITH CONDUCTIVE VIA | 株式会社レゾナック | 2024-09-19 | — | — | WO | disclosed |
| US-20240300055-A1 | METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR | RESONAC CORPORATION (JP) | 2024-09-12 | — | — | US | disclosed |
| US-20240181575-A1 | COPPER PASTE FOR FORMING SINTERED COPPER PILLARS AND METHOD FOR PRODUCING BONDED BODY | RESONAC CORPORATION (JP) | 2024-06-06 | — | — | US | disclosed |
| CN-111247629-A | Component connection method | 日立化成株式会社 | 2020-06-05 | — | — | CN | disclosed |
| CN-111247647-A | Method for manufacturing thermoelectric conversion module, and bonding material for thermoelectric conversion module | 日立化成株式会社 | 2020-06-05 | — | — | CN | disclosed |
| CN-111230125-A | Copper paste for bonding, method for producing bonded body, and method for producing semiconductor device | 日立化成株式会社 | 2020-06-05 | — | — | CN | disclosed |
| CN-107921541-B | Bonded body and semiconductor device | 日立化成株式会社 | 2020-04-28 | — | — | CN | disclosed |
| WO-2020054581-A1 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | 日立化成株式会社 | 2020-03-19 | — | — | WO | disclosed |
| CN-107921540-B | Copper paste for bonding, method for producing bonded body, and method for producing semiconductor device | 日立化成株式会社 | 2020-03-03 | — | — | CN | disclosed |
| CN-107949447-B | Copper paste for bonding, method for producing bonded body, and method for producing semiconductor device | 日立化成株式会社 | 2020-03-03 | — | — | CN | disclosed |
| CN-110167695-A | Engagement copper thickener, conjugant and semiconductor device without pressurization | 日立化成株式会社 | 2019-08-23 | — | — | CN | disclosed |
| CN-109070206-A | The engagement manufacturing method of copper thickener, the manufacturing method of conjugant and semiconductor device | 日立化成株式会社 | 2018-12-21 | — | — | CN | disclosed |
| US-6645951-B1 | Antiestrogens for treating breast cancer | CHUGAI SEIYAKU KABUSHIKI KAISHA (JP) | 2003-11-11 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20250387833-A1 | METHOD FOR MANUFACTURING CONDUCTIVE VIA-CONTAINING SUBSTRATE, CONDUCTIVE VIA-CONTAINING SUBSTRATE, AND METAL PASTE | C5, C9, CUTA | TBXAS1 4583/4885CETP 1026/4885CYP2C19 979/4885 |
| US-12564879-B2 | Copper paste for joining, method for manufacturing joined body, and joined body | DCX, DNAJA2, DNAJA1 | TBXAS1 2272/4885CETP 252/4885CYP2C19 495/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.