Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HRH1 | P35367 | 2/20 | 0.76 |
| ▸ | NAAA | Q02083 | 1/20 | 0.61 |
| ▸ | HRH3 | Q9Y5N1 | 3/20 | 0.59 |
| ▸ | CYP1A2 | P05177 | 4/20 | 0.58 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.58 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.57 |
| ▸ | LMNA | P02545 | 1/20 | 0.57 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.57 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.57 |
| ▸ | HRH4 | Q9H3N8 | 2/20 | 0.56 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.53 |
| ▸ | MAPT | P10636 | 1/20 | 0.52 |
| ▸ | LIN28A | Q9H9Z2 | 1/20 | 0.52 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.52 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.50 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL5827595 | 0.97 | HRH1 (0.73) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL659243 | 0.97 | HRH1 (0.80) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL11734076 | 0.97 | HRH1 (0.80) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL4418086 | 0.97 | HRH1 (0.80) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL2843489 | 0.97 | HRH1 (0.80) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL31040594 | 0.97 | HRH1 (0.80) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL29485637 | 0.95 | HRH1 (0.69) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL231470 | 0.95 | HRH1 (0.69) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| Hydrochloric Acid SCHEMBL841530 | 0.92 | HRH1 (0.67) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 | |
| SCHEMBL5961501 | 0.92 | HRH1 (0.67) | HRH1NAAAHRH3CYP1A2SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11697884-B2 | Copper deposition in wafer level packaging of integrated circuits | MACDERMID ENTHONE INC. (US) | 2023-07-11 | — | — | US | disclosed |
| CN-114420633-A | Copper deposition in wafer level packaging of integrated circuits | 麦克德米德乐思公司 | 2022-04-29 | — | — | CN | disclosed |
| US-20210388519-A1 | Copper Deposition in Wafer Level Packaging of Integrated Circuits | MACDERMID ENTHONE INC. | 2021-12-16 | — | — | US | disclosed |
| US-11124888-B2 | Copper deposition in wafer level packaging of integrated circuits | MACDERMID ENTHONE INC. (US) | 2021-09-21 | — | — | US | disclosed |
| EP-3504186-A1 | COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS | MacDermid Enthone Inc. (US) | 2019-07-03 | — | — | EP | disclosed |
| US-10221496-B2 | Copper filling of through silicon vias | MACDERMID ENTHONE INC. (US) | 2019-03-05 | — | — | US | disclosed |
| US-20190003068-A9 | COPPER FILLING OF THROUGH SILICON VIAS | ENTHONE INC. (US) | 2019-01-03 | — | — | US | disclosed |
| US-20180355502-A1 | PROCESS FOR METALIZATION OF COPPER PILLARS IN THE MANUFACTURE OF MICROELECTRONICS | CITIBANK, N.A. | 2018-12-13 | — | — | US | disclosed |
| WO-2018226988-A1 | PROCESS FOR FILLING VIAS IN THE MANUFACTURE OF MICROELECTRONICS | MACDERMID ENTHONE INC. (US) | 2018-12-13 | — | — | WO | disclosed |
| US-10103029-B2 | Process for filling vias in the microelectronics | MACDERMID ENTHONE INC. (US) | 2018-10-16 | — | — | US | disclosed |
| US-20140120722-A1 | PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS | ENTHONE INC. (US) | 2014-05-01 | — | — | US | disclosed |
| EP-2668317-A1 | PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS | Enthone, Inc. (US) | 2013-12-04 | — | — | EP | disclosed |
| US-20130241060-A1 | METHOD AND COMPOSITION FOR ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS | ENTHONE INC. (US) | 2013-09-19 | — | — | US | disclosed |
| US-20130199935-A1 | COPPER FILLING OF THROUGH SILICON VIAS | ENTHONE INC. (US) | 2013-08-08 | — | — | US | disclosed |
| US-8388824-B2 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | ENTHONE INC. (US) | 2013-03-05 | — | — | US | disclosed |
| WO-2012103357-A1 | PROCESS FOR FILLING VIAS IN THE MICROELECTRONICS | ENTHONE INC. (US) | 2012-08-02 | — | — | WO | disclosed |
| WO-2011149965-A2 | COPPER FILLING OF THROUGH SILICON VIAS | ENTHONE INC. (US) | 2011-12-01 | — | — | WO | disclosed |
| US-20100126872-A1 | ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS | ENTHONE, INC. (US) | 2010-05-27 | — | — | US | disclosed |
| US-4212978-A | Process for the catalytic production of 2-substituted pyridines | LONZA LTD. (CH) | 1980-07-15 | — | — | US | disclosed |
| US-4196287-A | Process for the catalytic production of 2-substituted pyridines | LONZA LTD. (CH) | 1980-04-01 | — | — | US | disclosed |