SCHEMBL728307

SCHEMBL728307

C(OCC1CO1)C1CO1.Cc1cccc(-c2cccc(C)c2C)c1C

nearest known ligand 0.50

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.50
GLA P06280 1/20 0.50
TSHR P16473 5/20 0.44
TP53 P04637 3/20 0.44
SMN1; SMN2 Q16637 3/20 0.44
HIF1A Q16665 2/20 0.44
CYP3A4 P08684 1/20 0.44
TDP1 Q9NUW8 2/20 0.42
MAPK1 P28482 1/20 0.40
MAPT P10636 3/20 0.37
HPGD P15428 2/20 0.37
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
CYP1A2 P05177 1/20 0.37
PPARG P37231 1/20 0.37
HTR2A P28223 1/20 0.36
HTR2C P28335 1/20 0.36
HTR2B P41595 1/20 0.36
GRM2 Q14416 3/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6577504 0.91 ALDH1A1 (0.55) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL3855211 0.85 ALDH1A1 (0.58) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL3848081 0.83 ALDH1A1 (0.55) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL27859316 0.83 TRPA1 (0.57) ALDH1A1GLATSHRTP53SMN1; SMN2
O-Xylene SCHEMBL27476227 0.83 ALDH1A1 (0.63) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL27844820 0.81 ALDH1A1 (0.46) ALDH1A1GLATSHRTP53SMN1; SMN2
Ammonia Solution, Strong SCHEMBL28677700 0.81 TRPA1 (0.55) ALDH1A1GLATSHRTP53SMN1; SMN2
Benzene SCHEMBL27574432 0.81 TRPA1 (0.55) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL3671558 0.80 ALDH1A1 (0.52) ALDH1A1GLATSHRTP53SMN1; SMN2
SCHEMBL28045493 0.80 ALDH1A1 (0.52) ALDH1A1GLATSHRTP53SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 133 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2004746-B1 RADIATION-CURABLE RUBBER ADHESIVE/SEALANT HENKEL AG & CO KGAA (DE) 2018-08-01 EP claimed
EP-0775591-B1 Thermal melt-transfer recording material FUJI KAGAKU SHIKOGYO (JP) 2002-03-13 EP claimed
US-5935709-A FOUNDATION, HEAT-MELTABLE INK LAYER, EPOXY RESIN; SCRATCH RESISTANCE FUJICOPIAN CO., LTD. (JP) 1999-08-10 US claimed
EP-0775591-A2 Thermal melt-transfer recording material FUJICOPIAN CO., LTD. (JP) 1997-05-28 EP claimed
US-12241200-B2 Sizing agent composition for fibers, fiber bundle, fiber product and composite material SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2025-03-04 US disclosed
US-20240384128-A1 LOW VOLATILE ORGANIC CONTENT WATER REDUCIBLE FLUID RESISTANT COATING PRC-DESOTO INTERNATIONAL, INC. (US) 2024-11-21 US disclosed
EP-4402217-A1 LOW VOLATILE ORGANIC CONTENT WATER REDUCIBLE FLUID RESISTANT COATING PRC-Desoto International, Inc. (US) 2024-07-24 EP disclosed
US-20240239960-A1 MULTIPLE CURE COREACTIVE COMPOSITIONS FOR ADDITIVE MANUFACTURING AND USES THEREOF PPG INDUSTRIES OHIO, INC. (US) 2024-07-18 US disclosed
US-20240199911-A1 HYBRID DUAL CURE COMPOSITIONS PRC-DESOTO INTERNATIONAL, INC. (US) 2024-06-20 US disclosed
CN-115038753-B Composition, curable composition, cured product, and storage method 株式会社钟化 2024-03-19 CN disclosed
EP-4330311-A1 MULTIPLE CURE COREACTIVE COMPOSITIONS FOR ADDITIVE MANUFACTURING AND USES THEREOF PPG Industries Ohio Inc. (US) 2024-03-06 EP disclosed
EP-4314115-A1 HYBRID DUAL CURE COMPOSITIONS PRC-Desoto International, Inc. (US) 2024-02-07 EP disclosed
US-20030100623-A1 Polyether, active-hydrogen ingredient , resin-forming composition, and process for producing foam SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2003-05-29 US disclosed
EP-1293549-A1 ADHESIVE FOR RESIN ROLL ASSEMBLY AND RESIN ROLL SANYO CHEMICAL INDUSTRIES, Ltd. (JP) 2003-03-19 EP disclosed
EP-1283236-A1 RESIN DISPERSIONS HAVING UNIFORM PARTICLE DIAMETERS, RESIN PARTICLES AND PROCESSES FOR PRODUCING BOTH SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-12 EP disclosed
US-6495653-B1 RETAINING CURABILITY EVEN AT A LOW TEMPERATURES, LOW VISCOSITY, RAPID CURE SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2002-12-17 US disclosed
EP-0775591-B1 Thermal melt-transfer recording material FUJI KAGAKU SHIKOGYO (JP) 2002-03-13 EP disclosed
JP-2000034338-A LIQUID THERMOSETTING RESIN COMPOSITION MITSUBISHI ELECTRIC CORP 2000-02-02 JP disclosed
US-5935709-A FOUNDATION, HEAT-MELTABLE INK LAYER, EPOXY RESIN; SCRATCH RESISTANCE FUJICOPIAN CO., LTD. (JP) 1999-08-10 US disclosed
EP-0775591-A2 Thermal melt-transfer recording material FUJICOPIAN CO., LTD. (JP) 1997-05-28 EP disclosed