Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3363301 | 0.92 | — | — | |
| SCHEMBL74717 | 0.88 | ALDH1A1 (0.41) | ALDH1A1TSHR | |
| SCHEMBL22711080 | 0.85 | ALDH1A1 (0.39) | ALDH1A1TSHR | |
| SCHEMBL8853367 | 0.80 | ALDH1A1 (0.35) | ALDH1A1TSHR | |
| SCHEMBL1051766 | 0.78 | ALDH1A1 (0.33) | ALDH1A1TSHR | |
| SCHEMBL130980 | 0.77 | ALDH1A1 (0.37) | ALDH1A1TSHR | |
| SCHEMBL338658 | 0.76 | — | — | |
| SCHEMBL10795711 | 0.74 | ALDH1A1 (0.35) | ALDH1A1TSHR | |
| SCHEMBL1638894 | 0.74 | ALDH1A1 (0.35) | ALDH1A1TSHR | |
| SCHEMBL838347 | 0.74 | ALDH1A1 (0.42) | ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | claimed |
| US-8137764-B2 | organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-03-20 | — | — | US | claimed |
| US-20040241463-A1 | Mechanical enhancer additives for low dielectric films | VERSUM MATERIALS US, LLC | 2004-12-02 | — | — | US | claimed |
| EP-1482070-A1 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-12-01 | — | — | EP | claimed |
| US-11164739-B2 | Use of silicon structure former with organic substituted hardening additive compounds for dense OSG films | VERSUM MATERIALS US, LLC (US) | 2021-11-02 | — | — | US | disclosed |
| US-20190244810-A1 | Use of Silicon Structure Former with Organic Substituted Hardening Additive Compounds for Dense OSG Films | VERSUM MATERIALS US, LLC (US) | 2019-08-08 | — | — | US | disclosed |
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | disclosed |
| US-8137764-B2 | organosilicate film formed by plasma-enhanced chemical vapor deposition from a first silicon-containing precursor that comprises from 3 to 4 Si O bonds per Si atom, from 0 to 1 of Si H, Si Br, and Si Cl bonds per Si atom and a second silicon-containing precursor comprises at least one Si C bond per Si | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-03-20 | — | — | US | disclosed |
| EP-2261390-A2 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2010-12-15 | — | — | EP | disclosed |
| US-20040241463-A1 | Mechanical enhancer additives for low dielectric films | VERSUM MATERIALS US, LLC | 2004-12-02 | — | — | US | disclosed |
| EP-1482070-A1 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-12-01 | — | — | EP | disclosed |