SCHEMBL7459304

SCHEMBL7459304

Nc1ccc(-c2cc(O)c(N)cc2C(F)(F)F)cc1O

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALOX15 P16050 2/20 0.53
HSD17B10 Q99714 2/20 0.53
CYP3A4 P08684 1/20 0.53
GAA P10253 3/20 0.40
POLB P06746 2/20 0.40
GLA P06280 1/20 0.40
TSHR P16473 1/20 0.40
HSD17B1 P14061 3/20 0.39
HSD17B2 P37059 3/20 0.39
PGR P06401 1/20 0.38
AR P10275 1/20 0.38
CFTR P13569 2/20 0.36
BRD4 O60885 1/20 0.36
KDM4E B2RXH2 2/20 0.36
MEN1 O00255 2/20 0.36
MAPT P10636 2/20 0.36
KMT2A Q03164 2/20 0.36
RAB9A P51151 1/20 0.36
KIF11 P52732 3/20 0.35
CA12 O43570 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7719512 0.90 ALDH1A1 (0.46) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL7719540 0.87 ALOX15 (0.50) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL29520987 0.83 GAA (0.45) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL5038838 0.83 GAA (0.45) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL7455080 0.83 ALDH1A1 (0.46) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL5844871 0.81 BACE1 (0.52) ALOX15HSD17B10CYP3A4TSHRHSD17B1
SCHEMBL6849083 0.80 GAA (0.42) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL23137330 0.79 ALOX15 (0.76) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL3137327 0.79 CYP3A4 (0.48) ALOX15HSD17B10CYP3A4GAAPOLB
SCHEMBL7718839 0.77 ALDH1A1 (0.43) ALOX15HSD17B10CYP3A4GAAHSD17B1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118355077-A Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device 爱天思株式会社 2024-07-16 CN disclosed
CN-118339213-A Thermosetting composition, adhesive sheet, printed wiring board, and electronic device 爱天思株式会社 2024-07-12 CN disclosed
CN-114450350-B Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device 东丽株式会社 2024-06-28 CN disclosed
CN-112180685-B Positive photosensitive resin composition, cured film and pattern processing method of cured film 武汉柔显科技股份有限公司 2024-06-25 CN disclosed
CN-118251632-A Photosensitive resin composition, cured product, method for producing cured product, organic EL display device, and display device 东丽株式会社 2024-06-25 CN disclosed
CN-118222091-A Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device 爱天思株式会社 2024-06-21 CN disclosed
CN-117858921-A Resin composition, cured product, organic EL display device, and method for producing cured product 东丽株式会社 2024-04-09 CN disclosed
CN-112654927-B Photosensitive resin composition, resin sheet, cured film, organic EL display device, semiconductor electronic component, semiconductor device, and method for producing organic EL display device 东丽株式会社 2024-02-27 CN disclosed
CN-117480218-A Xanthene compound, resin composition, cured product, method for producing cured product, organic EL display device, and display device 东丽株式会社 2024-01-30 CN disclosed
CN-114014810-B Imidization rate accelerator, resin composition, preparation method and application thereof 上海邃铸科技有限公司 2023-12-26 CN disclosed
CN-112939915-A Diamine monomer for photosensitive resin, polyimide precursor, photosensitive resin composition, and use thereof 武汉柔显科技股份有限公司 2021-06-11 CN disclosed
CN-112654927-A Photosensitive resin composition, resin sheet, cured film, organic EL display device, semiconductor electronic component, semiconductor device, and method for producing organic EL display device 东丽株式会社 2021-04-13 CN disclosed
CN-112180684-A Positive photosensitive resin composition, cured film and pattern processing method thereof 武汉柔显科技股份有限公司 2021-01-05 CN disclosed
CN-107406590-B Resin, photosensitive resin composition, and electronic component and display device using the same 东丽株式会社 2020-08-04 CN disclosed
WO-2020059485-A1 PHOTOSENSITIVE RESIN COMPOSITION, RESIN SHEET, CURED FILM, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE 東レ株式会社 2020-03-26 WO disclosed
US-6380271-B1 MIXING A POLYBENZOXAZOLE PRECURSOR OR A POLYBENZOXAZOLE RESIN WITH AN OLIGOMER, FORMING FILM FROM RESULTING MIXTURE, HEATING FILM IN NITROGEN CONTAINING OXYGEN TO GIVE RISE TO THERMAL DECOMPOSITION AND GASIFICATION OF OLIGOMER TO FORM RESIN LAYER SUMITOMO BAKELITE COMPANY LIMITED (JP) 2002-04-30 US disclosed
EP-0990673-B1 Polybenzoxazole resin and precursor thereof SUMITOMO BAKELITE CO (JP) 2002-03-20 EP disclosed
US-6297351-B1 EXCELLENT IN ELECTRIC CHARACTERISTICS AND HEAT RESISTANCE, PRECURSOR FROM A DICARBOXYLIC ACID AND A BISAMINOPHENOL COMPOUND OR A DIAMINODIHYDROXY SUMITOMO BAKELITE COMPANY LIMITED (JP) 2001-10-02 US disclosed
US-6204356-B1 CYCLIZATION SUMITOMO BAKELITE COMPANY LIMITED (JP) 2001-03-20 US disclosed
EP-0990673-A2 Polybenzoxazole resin and precursor thereof SUMITOMO BAKELITE COMPANY LIMITED (JP) 2000-04-05 EP disclosed