SCHEMBL29520987

SCHEMBL29520987

Nc1cc(C(F)(F)F)c(-c2cc(O)c(N)cc2C(F)(F)F)cc1O

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 3/20 0.45
GLA P06280 1/20 0.45
POLB P06746 1/20 0.45
TSHR P16473 1/20 0.45
CA12 O43570 1/20 0.42
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA4 P22748 1/20 0.42
CA6 P23280 1/20 0.42
CA5A P35218 1/20 0.42
CA7 P43166 1/20 0.42
CA9 Q16790 1/20 0.42
CA14 Q9ULX7 1/20 0.42
CA5B Q9Y2D0 1/20 0.42
CFTR P13569 8/20 0.37
ALDH1A1 P00352 4/20 0.35
MEN1 O00255 2/20 0.35
MAPT P10636 2/20 0.35
PKM P14618 2/20 0.35
KMT2A Q03164 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5038838 1.00 GAA (0.45) GAAGLAPOLBTSHRCA12
SCHEMBL6849083 0.96 GAA (0.42) GAAGLAPOLBTSHRCA12
SCHEMBL5044756 0.91 GAA (0.45) GAAGLAPOLBTSHRCA12
SCHEMBL29860776 0.90 GAA (0.38) GAAGLAPOLBTSHRCA12
SCHEMBL7719512 0.83 ALDH1A1 (0.46) GAAGLAPOLBTSHRCA12
SCHEMBL7459304 0.83 ALOX15 (0.53) GAAGLAPOLBTSHRCA12
SCHEMBL6853581 0.80 CA12 (0.41) GAAGLAPOLBTSHRCA12
SCHEMBL6854383 0.80 CA12 (0.41) GAAGLAPOLBTSHRCA12
SCHEMBL6853665 0.80 CA12 (0.41) GAAGLAPOLBTSHRCA12
SCHEMBL1027386 0.80 KIF11 (0.41) GAAGLAPOLBTSHRCA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250197634-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME TORAY INDUSTRIES, INC. (JP) 2025-06-19 US disclosed
EP-4498158-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME Toray Industries, Inc. (JP) 2025-01-29 EP disclosed
CN-115678005-B Polymer, resin composition, resin film, semiconductor device, and light-emitting device 上海邃铸科技有限公司 2024-10-01 CN disclosed
CN-118355077-A Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device 爱天思株式会社 2024-07-16 CN disclosed
CN-118222091-A Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device 爱天思株式会社 2024-06-21 CN disclosed
CN-114014810-B Imidization rate accelerator, resin composition, preparation method and application thereof 上海邃铸科技有限公司 2023-12-26 CN disclosed
WO-2023182041-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT USING SAME 東レ株式会社 2023-09-28 WO disclosed
WO-2023162718-A1 RESIN COMPOSITION, RESIN COMPOSITION COATING FILM, RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE USING THESE PRODUCTS 東レ株式会社 2023-08-31 WO disclosed
WO-2023148996-A1 RESIN COMPOSITION, RESIN COMPOSITION COATING, RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT 東レ株式会社 2023-08-10 WO disclosed
WO-2023032467-A1 RESIN COMPOSITION, RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE 東レ株式会社 2023-03-09 WO disclosed
WO-2023032803-A1 RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED PRODUCT 東レ株式会社 2023-03-09 WO disclosed
CN-115678005-A Polymer, resin composition, resin film, semiconductor device, and light-emitting device 上海邃铸科技有限公司 2023-02-03 CN disclosed
CN-115244625-A Scintillator panel and method for manufacturing scintillator panel 东丽株式会社 2022-10-25 CN disclosed
CN-114450350-A Resin composition, resin composition film, cured film, hollow structure using the same, and semiconductor device 东丽株式会社 2022-05-06 CN disclosed
WO-2022054850-A1 SOLVENT FOR RESIN SYNTHESIS AND METHOD FOR PRODUCING SYNTHETIC RESIN USING SAID SOLVENT KJケミカルズ株式会社 2022-03-17 WO disclosed