Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.56 |
| ▸ | CA2 | P00918 | 1/20 | 0.56 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.43 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.43 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 4/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.41 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | USP2 | O75604 | 1/20 | 0.39 |
| ▸ | ACHE | P22303 | 2/20 | 0.38 |
| ▸ | PTGS1 | P23219 | 3/20 | 0.36 |
| ▸ | PTGS2 | P35354 | 3/20 | 0.36 |
| ▸ | GAA | P10253 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | ALOX5 | P09917 | 2/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | RECQL | P46063 | 1/20 | 0.36 |
| ▸ | G6PD | P11413 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5520610 | 0.84 | CA1 (0.54) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL5526665 | 0.83 | CA1 (0.52) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL8895164 | 0.80 | CA1 (0.54) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL9571457 | 0.79 | CA1 (0.59) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| Ethane SCHEMBL28865517 | 0.77 | CA1 (0.50) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL8043644 | 0.77 | PDE4B (0.46) | CA1CA2ACHEPTGS1PTGS2 | |
| SCHEMBL1224697 | 0.76 | CA1 (0.62) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL29379546 | 0.75 | CA1 (0.68) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| Ethane SCHEMBL28219675 | 0.75 | CA1 (0.48) | CA1CA2CYP1A2CYP2C9CYP2C19 | |
| SCHEMBL3752346 | 0.74 | CA1 (0.59) | CA1CA2CYP1A2CYP2C9CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10162260-B2 | Photosensitive resin composition, protective film, and liquid crystal display element | CHI MEI CORPORATION (TW) | 2018-12-25 | — | — | US | disclosed |
| US-20170168390-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT | CHI MEI CORPORATION (TW) | 2017-06-15 | — | — | US | disclosed |
| US-9541832-B2 | Photosensitive resin composition, protective film and element having the same | CHI MEI CORPORATION (TW) | 2017-01-10 | — | — | US | disclosed |
| US-9422446-B2 | Photosensitive resin composition, protective film and element having the same | CHI MEI CORPORATION (TW) | 2016-08-23 | — | — | US | disclosed |
| US-9395627-B2 | Positive photosensitive resin composition and method for forming pattern by using the same | CHI MEI CORPORATION | 2016-07-19 | — | — | US | disclosed |
| US-20150378256-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME | CHI MEI CORPORATION (TW) | 2015-12-31 | — | — | US | disclosed |
| US-20150376355-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE SAME | CHI MEI CORPORATION (TW) | 2015-12-31 | — | — | US | disclosed |
| US-9190521-B2 | Positive photosensitive resin composition and uses thereof | CHI MEI CORPORATION (TW) | 2015-11-17 | — | — | US | disclosed |
| US-8980506-B2 | Photosensitive resin composition and application thereof | CHI MEI CORPORATION (TW) | 2015-03-17 | — | — | US | disclosed |
| US-20150072275-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERN BY USING THE SAME | CHI MEI CORPORATION (TW) | 2015-03-12 | — | — | US | disclosed |
| US-20130164461-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND USES THEREOF | CHI MEI CORPORATION (TW) | 2013-06-27 | — | — | US | disclosed |
| US-20120328799-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERNS BY USING THE SAME | CHI MEI CORPORATION (TW) | 2012-12-27 | — | — | US | disclosed |
| US-20120287393-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERNS BY USING THE SAME | CHI MEI COOPERATION (TW) | 2012-11-15 | — | — | US | disclosed |
| EP-0848289-B1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2002-02-27 | — | — | EP | disclosed |
| US-5928837-A | Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| EP-0848289-A1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-06-17 | — | — | EP | disclosed |
| US-5601961-A | QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-02-11 | — | — | US | disclosed |
| US-5576138-A | MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-11-19 | — | — | US | disclosed |
| US-5501936-A | IMPROVED RESOLUTION OF VERY FINE PATTERNS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1996-03-26 | — | — | US | disclosed |
| US-5478692-A | Fine patterning for electronics | TOKYO OHKA KOGYO CO., LTD. (JP) | 1995-12-26 | — | — | US | disclosed |