SCHEMBL7535803

SCHEMBL7535803

CO[Si](OC)(OC)c1ccccc1CC#N

nearest known ligand 0.40

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.40
HPGD P15428 1/20 0.40
MEN1 O00255 1/20 0.33
MAPT P10636 1/20 0.33
KMT2A Q03164 1/20 0.33
ATP4A P20648 2/20 0.32
ATP4B P51164 2/20 0.32
CYP1A1 P04798 1/20 0.31
CYP1A2 P05177 1/20 0.31
CYP1B1 Q16678 1/20 0.31
TSHR P16473 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
LMNA P02545 1/20 0.30
FFAR1 O14842 1/20 0.30
FFAR4 Q5NUL3 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1225016 0.80 ALDH1A1 (0.36) ALDH1A1HPGD
SCHEMBL30504300 0.80 ALDH1A1 (0.36) ALDH1A1HPGD
SCHEMBL7163805 0.79 ALDH1A1 (0.43) ALDH1A1HPGDMEN1MAPTKMT2A
SCHEMBL20584031 0.78 HSPA5 (0.36) ALDH1A1MAPT
SCHEMBL669702 0.76 GABRA1 (0.38) HPGDMAPTNPSR1
SCHEMBL2108819 0.75 IDO1 (0.40) ALDH1A1
SCHEMBL4843001 0.75 IDO1 (0.31) ALDH1A1
SCHEMBL240617 0.75 ALDH1A1 (0.34) ALDH1A1KMT2ATSHR
SCHEMBL4420821 0.75 IDO1 (0.31) ALDH1A1
SCHEMBL4844480 0.75 ALDH1A1 (0.31) ALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0729293-B1 Selective metallization process CALABRESE GARY S (US) 2002-04-03 EP disclosed
EP-0510711-B1 Processes and compositions for electroless metallization CALVERT JEFFREY M (US) 2001-06-27 EP disclosed
EP-0729293-A1 Selective metallization process Calabrese, Gary S. (US) 1996-08-28 EP disclosed
US-5510216-A Selective metallization process SHIPLEY COMPANY INC. (US) 1996-04-23 US disclosed
US-5500315-A AN ARTICLE COMPRISING AN IMAGE PATTERN ON A SUBSTRATE ROHM & HAAS COMPANY (US) 1996-03-19 US disclosed
US-5468597-A Selective metallization process SHIPLEY COMPANY, L.L.C. (US) 1995-11-21 US disclosed
US-5389496-A Using chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups chemically bound to the substrate ROHM AND HAAS COMPANY (US) 1995-02-14 US disclosed
EP-0510711-A2 Processes and compositions for electroless metallization Calvert, Jeffrey M. (US) 1992-10-28 EP disclosed